10M02DCV36C7G - 2K Logic Elements FPGA | Intel | Embedded Control
MPN: 10M02DCV36C7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.578 | $4.58 |
| 10 | $4.12 | $41.20 |
| 100 | $3.65 | $365.00 |
| 500 | $3.18 | $1,590.00 |
| 1,000 | $2.71 | $2,710.00 |
| 3,000 | $2.34 | $7,020.00 |
10M02DCV36C7G Overview
The MAX 10 family is intended to support compact embedded systems where hardware flexibility, rapid design iteration, and non-volatile configuration are useful. The target's 27 available I/O pins can connect digital sensors, control signals, communications interfaces, and application processors. Its embedded memory capacity of 110,592 bits supports moderate buffering, lookup-table storage, and small data or control stores. The 36-WLCSP footprint makes it suitable for space-constrained boards, although assembly and PCB routing require careful consideration of the fine-pitch ball grid.
The verified data identifies 2,000 logic elements, 27 I/O, 110,592 embedded memory bits, 55 nm technology, and 1.2 V operation. These parameters define a small FPGA suitable for glue logic, interface translation, configurable timing, and distributed control. Compared with a fixed-function controller, the FPGA can change logic behavior after PCB fabrication. Compared with a larger FPGA, the 2,000-element device is constrained by limited logic and memory capacity, so designers should estimate resource utilization before committing to the part.
The device's non-volatile FPGA configuration is particularly relevant in systems that must retain behavior after power is removed. Typical designs can use the FPGA for sensor aggregation, motor or actuator control sequencing, legacy bus adaptation, or custom peripheral bridging. The 1.2 V supply requirement must be satisfied by the board power architecture, while the WLCSP package requires controlled thermal, assembly, and signal-integrity design. The verified sources do not provide a complete pinout, operating-temperature range, configuration details, or absolute electrical limits, so those values require datasheet confirmation before production design.
Practical applications include industrial control, embedded vision interfaces, robotics, test equipment, and portable electronics. A production design should validate the selected package against the PCB land pattern, confirm configuration and clocking requirements, and verify all supply, I/O, and timing limits in the manufacturer documentation. This page combines verified distributor specifications, pricing references, package-aware alternatives, and engineering considerations to help procurement and design teams assess 10M02DCV36C7G.
Drop-in alternatives for 10M02DCV36C7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 10M02DCV36C7G (same form factor and footprint) — differing in Configuration Memory, Package, Mounting Type, Logic Elements (LE), User I/O Count.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M02DCU324I7G
✅ Drop-In✓ In Stock
$1.55 / Unit
View Datasheet →10M02DCU324A7G
✅ Drop-In✓ In Stock
$6.3 / Unit
View Datasheet →10M50SCE144C8G
✅ Drop-In📋 Reference alternative (not in catalog)
10M02DCV36C7G Maximum Ratings & Electrical Characteristics
| Device Type | Non-volatile field-programmable gate array |
| Series | MAX 10 |
| Logic Elements | 2,000 |
| I/O Pins | 27 |
| Embedded Memory | 110,592 bits |
| Operating Voltage | 1.2 V |
| Process Technology | 55 nm |
| Package | 36-WFBGA, WLCSP |
| Mounting Type | Surface Mount |
| FPGA Configuration | Non-volatile |
| Logic Architecture | Field-programmable gate array |
| Product Category | Embedded FPGA |
| Package Pin Count | 36 balls |
10M02DCV36C7G 36 balls Pin Configuration Guide
Pin configuration for 10M02DCV36C7G (36 balls package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M02DCV36C7G.
Refer to the datasheet for full pin configuration.
Typical Applications
10M02DCV36C7G is suitable for 6 applications: Industrial Control Logic, Embedded Sensor Aggregation, Robotics Motion and I/O Sequencing, Portable Embedded Controller, Legacy Interface Bridge, Test and Measurement Fixture.
Industrial Control Logic
The Intel 10M02DCV36C7G fits industrial control logic that needs configurable sequencing, signal conditioning, and deterministic digital behavior in a compact footprint. Its 2,000 logic elements and 27 I/O pins provide enough resources for state machines, sensor-interface glue, actuator timing, and control-panel signal routing. The 1.2 V operating value should be incorporated into the board power tree, while the 36-WFBGA WLCSP package supports space-constrained control boards. Because the supplied data does not provide an operating-temperature range, qualification status, or complete timing limits, production use requires manufacturer datasheet validation. The FPGA can also isolate firmware from hardware timing changes and allow late control-logic revisions without a new PCB spin.
Recommended
Embedded Sensor Aggregation
10M02DCV36C7G can aggregate multiple slow or medium-speed digital sensor signals before data reaches an application processor or communications controller. The 27 I/O count is useful for combining chip-select, interrupt, enable, clock, and data-routing functions, while the 110,592-bit embedded memory can support small lookup tables, buffers, and control records. Its non-volatile FPGA behavior is advantageous when the system must restore deterministic interface logic immediately after power-up. The 55 nm process and 1.2 V operating value are headline device characteristics, not full electrical guarantees. Validate I/O standards, clock rates, pin assignments, configuration, and the WLCSP assembly process from the manufacturer documentation before releasing the sensor interface to production.
Recommended
Robotics Motion and I/O Sequencing
The 10M02DCV36C7G is well suited to robotics modules that need repeatable pulse generation, limit-switch handling, motor-enable sequencing, and synchronization between sensors and controllers. Its 2,000 logic elements can implement counters, pulse-width control, protocol framing, and safety interlocks, while 27 I/O pins support several peripheral functions. The non-volatile configuration allows the module to start with known hardware logic after every reset. The 36-WFBGA WLCSP package is compact but makes fan-out, via escape, inspection, and rework important PCB-layout considerations. The supplied data does not verify industrial temperature operation, timing margins, or absolute maximum ratings, so those details are [DATA_NEEDED: industrial and timing specifications] for a motor or robotics design.
Recommended
Portable Embedded Controller
10M02DCV36C7G can provide reconfigurable power-management sequencing, user-interface scanning, peripheral arbitration, and low-speed communications in portable equipment. The 1.2 V operating value and 2,000 logic elements are appropriate for compact controllers that need hardware timing without a large programmable-logic device. The 27 available I/O pins can coordinate buttons, displays, sensors, wireless modules, and power-enable signals. The non-volatile FPGA configuration is useful in battery-powered products because the system can recover deterministic logic after power restoration. The verified data does not include power-consumption, sleep, thermal, or operating-temperature specifications, so battery-life and thermal claims require [DATA_NEEDED: power and thermal limits] from the manufacturer documentation.
Recommended
Legacy Interface Bridge
The Intel 10M02DCV36C7G is useful for bridging legacy controllers, parallel buses, custom timing interfaces, and modern processors when protocol changes would otherwise require a new board. Its 2,000 logic elements can implement address decoding, data formatting, handshaking, clock-domain adaptation, and small FIFOs using the 110,592 embedded memory bits. The 27 I/O count supports a practical number of bus and control signals in a small design. Non-volatile configuration lets the bridge retain its interface personality across power cycles. The 36-WFBGA WLCSP package requires a verified land pattern and careful escape routing. Confirm signal-integrity, timing, voltage, and pinout data in the manufacturer documentation because those implementation details are not included in the supplied search snippets.
Recommended
Test and Measurement Fixture
10M02DCV36C7G can implement programmable stimulus, capture sequencing, measurement timing, and device-under-test interface control in compact test fixtures. The 2,000 logic elements and 27 I/O pins support counters, pulse generators, pattern generators, relay drivers, and trigger routing. Embedded memory of 110,592 bits can hold test patterns, calibration tables, or small captured records. The FPGA's non-volatile nature allows a fixture to boot into a known test personality without an external configuration download, while firmware can still be updated during development. The 1.2 V operating requirement must be included in the fixture supply design, and the WLCSP package requires controlled assembly. Timing accuracy, I/O limits, and measurement calibration remain [DATA_NEEDED: test and measurement limits] until confirmed from the official datasheet.
Recommended
Recommended Products Summary
Engineering reference data for 10M02DCV36C7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M02DCU324I7G | 10M02DCU324A7G | 10M50SCE144C8G |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 36-WFBGA, WLCSP | UBGA-324; not verified as same footprint | UBGA-324; not verified as same footprint | EQFP-144; not verified as same footprint |
| LABs/CLBs | 125 | 125 | 125 | 3,125 |
| Configuration Type | Non-volatile | Non-volatile family member | Non-volatile family member | MAX 10 family member |
| Drop-in Footprint | 36-WFBGA WLCSP | No package match verified | No package match verified | No package match verified |
Key Differentiators
- Compact non-volatile FPGA resource set (vs 10M50SCE144C8G)
- Verified small-scale MAX 10 resource profile (vs 10M02DCU324I7G)
- Low pin-count package for compact embedded designs (vs 10M02DCU324A7G)
Design Notes
Use the 1.2 V operating value only as the starting point for the power design. Confirm the exact supply rails, tolerances, sequencing, decoupling network, and power-up behavior in the manufacturer documentation before schematic release. Keep high-current and high-speed paths away from the FPGA supply pins, and use local decoupling placed at the associated power-entry locations. The supplied data does not contain absolute maximum ratings or current requirements, so those values remain [DATA_NEEDED: complete power specifications].
The 36-WFBGA WLCSP package requires a verified land pattern, escape-routing strategy, and assembly-aware fan-out. Do not route a replacement footprint or infer ball assignments from the distributor title. Confirm ball numbering, orientation, power and ground connections, and neighboring-ball constraints using the official package drawing. Use controlled-impedance planning where required, minimize via transitions, and provide a continuous reference plane. The complete pinout and package dimensions are [DATA_NEEDED: package pinout and land pattern] in the supplied snippets.
The FPGA should be treated as a configurable high-speed digital load even when the implemented logic uses modest clock rates. Confirm supported I/O standards, output drive settings, input thresholds, clock routing, and timing constraints in the official toolchain and datasheet. Keep clock and fast single-ended traces short, provide a solid reference plane, and avoid unnecessary layer transitions. The supplied data does not include timing, I/O electrical, or signal-integrity limits, so those values are [DATA_NEEDED: timing and I/O electrical limits].
The supplied results establish 55 nm process technology and a compact 36-WFBGA WLCSP package but do not provide power dissipation, thermal resistance, or junction-temperature limits. Estimate total power only after synthesis, placement, utilization, toggle rate, and I/O loading are known, then compare the estimate with the manufacturer's maximum allowed values. Provide a continuous ground or power-reference structure and follow the recommended thermal layout. The actual thermal limits are [DATA_NEEDED: thermal specifications].
Compliance Information
The supplied verified data does not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. Compliance values are therefore unknown rather than inferred. AEC-Q100 is not identified for this commercial programmable-logic listing.
