10M02DCU324I7G vs 10M02DCU324A7G Comparison

Detailed side-by-side comparison of 10M02DCU324I7G by Intel and 10M02DCU324A7G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 10M02DCU324I7G 10M02DCU324A7G
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $1.55 $6.30
Family MAX 10 MAX 10
Logic Elements (LEs) 2,000 —
Embedded Memory (M9K blocks) 16 —
Embedded Memory (bits) 110,592 —
Embedded Multipliers (18x18) 16 —
User I/O Count 160 160
User I/O Banks 8 —
Package 324-ball UBGA (U324) —
Pin/Pitch 324 balls / 0.8 mm pitch —
Process Node 55 nm —
Configuration Memory On-chip dual-boot flash —
Core Voltage (VCCINT) 1.2 V —
Analog Block 12-bit SAR ADC with temperature sensor —
Operating Temperature (Industrial) -40C to +100C (I7 grade) —
RoHS Status Compliant Compliant
Logic Elements (LE) — 2,000
Embedded Memory — 110,592 bits
Embedded 18x18 Multipliers — 16
PLLs — [DATA_NEEDED: PLL count]
Global Clock Networks — [DATA_NEEDED: global clock count]
User Flash Memory — Integrated (on-chip flash configuration)
Integrated ADC — 12-bit, 1 Msps+, successive approximation
Core Voltage — 1.15 V to 1.25 V
Supply Voltage (VCCIO) — [DATA_NEEDED: VCCIO range]
Operating Junction Temperature — -40 C to +125 C (TJ)
Package Type — 324-UBGA (Ultra FineLine BGA)
Package Dimensions — 15 x 15 mm
Mounting Type — Surface Mount
Process Technology — 55 nm embedded flash (TSMC)
Lead-Free / Halogen-Free — [DATA_NEEDED: lead-free status]

Datasheets & Resources

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