10M16DAF256C7G vs 10M08DAF256C7G Comparison

Detailed side-by-side comparison of 10M16DAF256C7G by Intel and 10M08DAF256C7G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 10M16DAF256C7G 10M08DAF256C7G
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $13.80 $7.95
Product Family MAX 10 —
Logic Elements (LE) 16000 8,000
Maximum User I/O 178 178
Embedded Memory Bits 562176 (549 Kbit) —
Embedded RAM Blocks M9K, 69 blocks (per family datasheet) —
Configuration Memory Dual-configuration flash (non-volatile) —
Package 256-LBGA (F256), 17x17 mm 256-pin LBGA (F256)
User Flash Memory (UFM) [DATA_NEEDED: UFM size in kB] —
18x18 Hardware Multipliers [DATA_NEEDED: multiplier count] —
PLLs [DATA_NEEDED: PLL count] 2
Integrated ADC Yes, 12-bit SAR (per MAX 10 family) —
Supply Voltage - Core 1.2 V (dual-supply variants) —
Supply Voltage - I/O 3.3 V (or LVCMOS 1.2-3.3 V per bank) —
Operating Temperature 0C to +85C (C7G suffix = commercial) 0 °C to +85 °C (Commercial, "C" grade)
Speed Grade 7 —
RoHS Status Compliant Compliant (Pb-free "G" suffix)
Mounting Type Surface Mount (BGA) Surface Mount
MSL Level 3 (per JEDEC J-STD-020, BGA package) —
Family — MAX 10
Embedded Memory (M9K blocks) — 46 (378 Kbits)
User Flash Memory — 387,072 bits (approx. 48 KB)
Core Voltage — 1.2 V
Package Dimensions — 17 mm × 17 mm, 1.0 mm ball pitch
On-chip ADC — 12-bit, 1 MSPS, 1 channel
18 × 18 Multipliers — 24
Configuration — Dual-configuration internal flash (D-series)
Process Technology — [DATA_NEEDED: process node, typically 55 nm embedded flash]
Internal Oscillator — Yes (on-chip)

Datasheets & Resources

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