10M16DAF256C7G vs 10M08DAF256C7G Comparaison
Comparaison détaillée côte à côte de 10M16DAF256C7G par Intel et 10M08DAF256C7G par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | 10M16DAF256C7G | 10M08DAF256C7G |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $13,80 | $7,95 |
| Product Family | MAX 10 | — |
| Logic Elements (LE) | 16000 | 8,000 |
| Maximum User I/O | 178 | 178 |
| Embedded Memory Bits | 562176 (549 Kbit) | — |
| Embedded RAM Blocks | M9K, 69 blocks (per family datasheet) | — |
| Configuration Memory | Dual-configuration flash (non-volatile) | — |
| Boîtier | 256-LBGA (F256), 17x17 mm | 256-pin LBGA (F256) |
| User Flash Memory (UFM) | [DATA_NEEDED: UFM size in kB] | — |
| 18x18 Hardware Multipliers | [DATA_NEEDED: multiplier count] | — |
| PLLs | [DATA_NEEDED: PLL count] | 2 |
| Integrated ADC | Yes, 12-bit SAR (per MAX 10 family) | — |
| Supply Voltage - Core | 1.2 V (dual-supply variants) | — |
| Supply Voltage - I/O | 3.3 V (or LVCMOS 1.2-3.3 V per bank) | — |
| Température de fonctionnement | 0C to +85C (C7G suffix = commercial) | 0 °C to +85 °C (Commercial, "C" grade) |
| Speed Grade | 7 | — |
| Statut RoHS | Compliant | Compliant (Pb-free "G" suffix) |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Niveau MSL | 3 (per JEDEC J-STD-020, BGA package) | — |
| Family | — | MAX 10 |
| Embedded Memory (M9K blocks) | — | 46 (378 Kbits) |
| User Flash Memory | — | 387,072 bits (approx. 48 KB) |
| Core Voltage | — | 1.2 V |
| Package Dimensions | — | 17 mm × 17 mm, 1.0 mm ball pitch |
| On-chip ADC | — | 12-bit, 1 MSPS, 1 channel |
| 18 × 18 Multipliers | — | 24 |
| Configuration | — | Dual-configuration internal flash (D-series) |
| Process Technology | — | [DATA_NEEDED: process node, typically 55 nm embedded flash] |
| Internal Oscillator | — | Yes (on-chip) |