10M25DAF256I7P vs 10M16DAF256C7G Comparison

Detailed side-by-side comparison of 10M25DAF256I7P by Intel and 10M16DAF256C7G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 10M25DAF256I7P 10M16DAF256C7G
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $47.80 $13.80
Family MAX 10 —
Logic Elements (LE) 25000 16000
Embedded Memory (M9K) 1134 Kbits —
Embedded Multipliers (18x18) 50 —
PLLs 4 [DATA_NEEDED: PLL count]
Maximum User I/Os 178 —
On-die Flash Configuration Dual-configuration supported —
ADC 12-bit, 1 MSPS, up to 16 analog inputs —
Process Technology 55 nm —
Core Voltage 1.2 V —
Operating Temperature -40C to +100C (Industrial) 0C to +85C (C7G suffix = commercial)
Package 256-pin FBGA (17 mm x 17 mm) 256-LBGA (F256), 17x17 mm
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
Configuration Memory On-chip flash (volatile mode optional) Dual-configuration flash (non-volatile)
Speed Grade 7 7
RoHS Status Compliant Compliant
Product Family — MAX 10
Maximum User I/O — 178
Embedded Memory Bits — 562176 (549 Kbit)
Embedded RAM Blocks — M9K, 69 blocks (per family datasheet)
User Flash Memory (UFM) — [DATA_NEEDED: UFM size in kB]
18x18 Hardware Multipliers — [DATA_NEEDED: multiplier count]
Integrated ADC — Yes, 12-bit SAR (per MAX 10 family)
Supply Voltage - Core — 1.2 V (dual-supply variants)
Supply Voltage - I/O — 3.3 V (or LVCMOS 1.2-3.3 V per bank)
MSL Level — 3 (per JEDEC J-STD-020, BGA package)

Datasheets & Resources

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