10M25DAF256I7P vs 10M25DAF256C8G Comparison
Detailed side-by-side comparison of 10M25DAF256I7P by Intel and 10M25DAF256C8G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 10M25DAF256I7P | 10M25DAF256C8G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $47.80 | $45.30 |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 25000 | 25,000 |
| Embedded Memory (M9K) | 1134 Kbits | — |
| Embedded Multipliers (18x18) | 50 | — |
| PLLs | 4 | 4 |
| Maximum User I/Os | 178 | — |
| On-die Flash Configuration | Dual-configuration supported | — |
| ADC | 12-bit, 1 MSPS, up to 16 analog inputs | — |
| Process Technology | 55 nm | — |
| Core Voltage | 1.2 V | [DATA_NEEDED: core voltage] |
| Operating Temperature | -40C to +100C (Industrial) | — |
| Package | 256-pin FBGA (17 mm x 17 mm) | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Configuration Memory | On-chip flash (volatile mode optional) | — |
| Speed Grade | 7 | C8 |
| RoHS Status | Compliant | Compliant |
| Embedded Memory | — | 1,728 Kbits |
| Embedded 18x18 Multipliers | — | 55 |
| User I/O Count | — | 178 |
| Hard ADC Blocks | — | 2 (12-bit) |
| Configuration Flash | — | Internal, non-volatile |
| Process Node | — | 55 nm TSMC |
| Temperature Grade | — | Commercial (0 °C to 85 °C) |
| I/O Bank Voltage Range | — | 1.2 V to 3.3 V LVCMOS/LVDS/SSTL |
| Lead-Free / Halogen-Free | — | Yes / Yes |
| MSL Level | — | [DATA_NEEDED: MSL level] |