10M25DAF484C8G vs 10M25DAF484A7G Comparison
Detailed side-by-side comparison of 10M25DAF484C8G by Intel and 10M25DAF484A7G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 10M25DAF484C8G | 10M25DAF484A7G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $50.00 | $52.75 |
| Family | MAX 10 | MAX 10 |
| Logic Elements | 25,000 | 25,000 |
| Embedded Memory (Kbits) | 1638 | — |
| User I/O Count | 360 | — |
| Process Technology | 55 nm CMOS | — |
| Core Supply Voltage (VCCINT) | 1.2 V (1.15 V min / 1.25 V max) | — |
| Package | 484-ball FineLine BGA (F484), 23 × 23 mm, 1.0 mm pitch | 484-ball BGA |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Operating Temperature | 0 °C to 85 °C (Commercial) | -40C to +125C (automotive) |
| Speed Grade | -8 | — |
| Configuration Memory | On-chip dual-configuration flash | On-chip flash (non-volatile) |
| ADC | Integrated 12-bit ADC (where enabled) | — |
| PLLs | Yes (up to 4 analog PLLs per device) | 8 |
| RoHS Status | Compliant | Compliant |
| MSL Level | MSL3 | — |
| Number of I/O Banks | 8 (per F484 pinout) | — |
| Embedded Memory (bits) | — | 691,200 |
| Embedded Memory Blocks | — | 360 (M9K) |
| 18x18 Multipliers | — | 25 |
| User I/O Pins | — | 360 |
| Global Clock Networks | — | 16 |
| On-chip ADC | — | 12-bit SAR, 16 channels, up to 1 Msps |
| Hard Memory Controller | — | DDR3 / LPDDR3 |
| Core Voltage | — | 1.2 V |
| I/O Voltage | — | 2.5 V / 3.3 V (bank-dependent) |