10M25DAF484C8G vs 10M25DAF484A7G Vergleich
Detaillierter Direktvergleich von 10M25DAF484C8G von Intel und 10M25DAF484A7G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M25DAF484C8G | 10M25DAF484A7G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $50,00 | $52,75 |
| Family | MAX 10 | MAX 10 |
| Logic Elements | 25,000 | 25,000 |
| Embedded Memory (Kbits) | 1638 | — |
| User I/O Count | 360 | — |
| Process Technology | 55 nm CMOS | — |
| Core Supply Voltage (VCCINT) | 1.2 V (1.15 V min / 1.25 V max) | — |
| Gehäuse | 484-ball FineLine BGA (F484), 23 × 23 mm, 1.0 mm pitch | 484-ball BGA |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Betriebstemperatur | 0 °C to 85 °C (Commercial) | -40C to +125C (automotive) |
| Speed Grade | -8 | — |
| Configuration Memory | On-chip dual-configuration flash | On-chip flash (non-volatile) |
| ADC | Integrated 12-bit ADC (where enabled) | — |
| PLLs | Yes (up to 4 analog PLLs per device) | 8 |
| RoHS-Status | Compliant | Compliant |
| MSL-Level | MSL3 | — |
| Number of I/O Banks | 8 (per F484 pinout) | — |
| Embedded Memory (bits) | — | 691,200 |
| Embedded Memory Blocks | — | 360 (M9K) |
| 18x18 Multipliers | — | 25 |
| User I/O Pins | — | 360 |
| Global Clock Networks | — | 16 |
| On-chip ADC | — | 12-bit SAR, 16 channels, up to 1 Msps |
| Hard Memory Controller | — | DDR3 / LPDDR3 |
| Core Voltage | — | 1.2 V |
| I/O Voltage | — | 2.5 V / 3.3 V (bank-dependent) |