5CSXFC5C6U23A7N vs 5CSXFC4C6U23C8N Comparison
Detailed side-by-side comparison of 5CSXFC5C6U23A7N by Intel and 5CSXFC4C6U23C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
5CSXFC5C6U23A7N - Cyclone V SX SoC FPGA, 85K LE, ARM Cortex-A9 | Intel
5CSXFC5C6U23A7N ✓ ActiveSpecification Comparison
| Parameter | 5CSXFC5C6U23A7N | 5CSXFC4C6U23C8N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $64.40 | $90.00 |
| Family | Cyclone V SX SoC FPGA | Cyclone V SX SoC FPGA |
| Logic Elements | 85K | 40,000 |
| Hard Processor Subsystem (HPS) | Dual-core ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Maximum Frequency | 700 MHz | — |
| Embedded Memory | 4,450 Kbits | — |
| DSP Blocks | 87 (variable-precision) | Variable-precision DSP |
| Transceivers | 6 (up to 3.125 Gbps) | Integrated high-speed transceivers |
| Package | 672-UBGA / UBGFA (23x23 mm) | 672-UBGA (23x23 mm) |
| Pin Count | 672 | — |
| Maximum User I/O | 145 (FPGA fabric I/O) | — |
| Process Technology | TSMC 28 nm low-power | TSMC 28 nm low-power |
| Core Voltage | 1.1 V | — |
| Operating Temperature (Automotive Grade) | -40C to +125C (junction) | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| RoHS Status | Compliant | Compliant |
| Memory Interfaces | DDR3, DDR2, LPDDR2 (via HPS) | — |
| Configuration | Serial (AS x4) and JTAG | — |
| Series | — | Cyclone V SX |
| Architecture | — | MCU + FPGA (Hard Processor System + Programmable Logic) |
| Hard Processor System (HPS) | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Clock Frequency | — | 600 MHz |
| User I/Os | — | 224 |
| Total I/O Count (per digchip) | — | 224 |
| Packaging | — | Tray |
| Operating Temperature Grade | — | Industrial (per device suffix 8) |
| On-chip Memory | — | M9K memory blocks |
| Export Control | — | May require additional documentation to export from the United States |