5CSXFC5C6U23A7N - Cyclone V SX SoC FPGA, 85K LE, ARM Cortex-A9 | Intel
MPN: 5CSXFC5C6U23A7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $77.55 | $77.55 |
| 10 | $74.2 | $742.00 |
| 100 | $70.5 | $7,050.00 |
| 500 | $67.8 | $33,900.00 |
| 1,000 | $64.4 | $64,400.00 |
Drop-in alternatives for 5CSXFC5C6U23A7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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5CSXFC6C6U23I7NES
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View Datasheet →5CSXFC4C6U23I7LN
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View Datasheet →5CSXFC5C6U23A7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SX SoC FPGA |
| Logic Elements | 85K |
| Hard Processor Subsystem (HPS) | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 700 MHz |
| Embedded Memory | 4,450 Kbits |
| DSP Blocks | 87 (variable-precision) |
| Transceivers | 6 (up to 3.125 Gbps) |
| Package | 672-UBGA / UBGFA (23x23 mm) |
| Pin Count | 672 |
| Maximum User I/O | 145 (FPGA fabric I/O) |
| Process Technology | TSMC 28 nm low-power |
| Core Voltage | 1.1 V |
| Operating Temperature (Automotive Grade) | -40C to +125C (junction) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Memory Interfaces | DDR3, DDR2, LPDDR2 (via HPS) |
| Configuration | Serial (AS x4) and JTAG |
5CSXFC5C6U23A7N 672-ubga / ubgfa (23x23 mm) Pin Configuration Guide
Complete pinout information for 5CSXFC5C6U23A7N (672-ubga / ubgfa (23x23 mm) package) with 672 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSXFC5C6U23A7N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 672 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSXFC5C6U23A7N is suitable for 6 applications: Industrial Machine Vision, Motor Control and Factory Automation, Automotive Infotainment and ADAS, Software-Defined Radio (SDR), Wireless Baseband Processing, Embedded Vision and Surveillance.
Industrial Machine Vision
The 5CSXFC5C6U23A7N fits industrial machine vision because its 85K logic elements and 87 variable-precision DSP blocks handle real-time pixel pipelines, edge detection, and convolutional filtering at Gigapixel/s rates. The six 3.125 Gbps transceivers ingest camera-link or CoaXPress streams directly, while the dual-core ARM Cortex-A9 HPS at 700 MHz runs the Linux-based vision stack, classification networks, and PLC/Profinet communication. The 672-UBGA package supports 145 user I/O for parallel sensor aggregation.
Recommended
Motor Control and Factory Automation
The 5CSXFC5C6U23A7N suits motor control and factory automation because its FPGA fabric runs deterministic field-oriented control (FOC) loops at sub-microsecond latency while the HPS executes the higher-level motion planner, EtherCAT or Profinet master, and HMI logic. The 87 DSP blocks accelerate Park/Clarke transforms and space-vector PWM generation, and the industrial temperature grade supports factory-floor deployment. The 672-UBGA package offers the high pin count needed for multi-axis feedback I/O.
Recommended
Automotive Infotainment and ADAS
The 5CSXFC5C6U23A7N fits automotive infotainment and driver-assistance because the dual-core ARM Cortex-A9 HPS runs the IVI OS and CAN/Ethernet stacks, while the FPGA fabric accelerates multi-camera video stitching, surround-view rendering, and object detection. Six 3.125 Gbps transceivers connect directly to automotive serializer/deserializer chips, and the A7 grade with the industrial/automotive temperature range supports in-cabin and under-hood operating conditions. The BGA package is AEC-Q100 friendly when paired with the right supplier screening.
Recommended
Software-Defined Radio (SDR)
The 5CSXFC5C6U23A7N fits software-defined radio platforms because its six transceivers at 3.125 Gbps sample wide-band RF signals directly into the FPGA fabric, where the 87 variable-precision DSP blocks implement channelizers, FIR filters, and FFT-based modulators. The dual-core Cortex-A9 HPS executes the protocol stack, modem control, and TCP/IP networking. The 672-UBGA package gives designers ample transceiver and GPIO routing for multi-band MIMO front ends.
Recommended
Wireless Baseband Processing
The 5CSXFC5C6U23A7N fits small-cell wireless baseband processing because the FPGA fabric implements LTE PHY-layer acceleration including FFT/iFFT, channel coding, and MIMO detection, while the dual-core ARM Cortex-A9 HPS runs the L2/L3 protocol stack and OAM software. The 4,450 Kbits of embedded memory buffers subframes at low latency, and the six 3.125 Gbps transceivers interface to RF front-end cards and CPRI backhaul. Industrial temperature grade supports outdoor small-cell deployment.
Recommended
Embedded Vision and Surveillance
The 5CSXFC5C6U23A7N fits embedded vision and surveillance because its 85K logic elements and 87 DSP blocks process multiple HD video streams in parallel through hardware pipelines, while the ARM Cortex-A9 HPS runs analytics, event detection, and network streaming. Six 3.125 Gbps transceivers accept multi-sensor inputs, and the DDR3 controller in the HPS provides ample memory bandwidth for frame buffering. The 672-UBGA package supports the high pin count needed for parallel camera interfaces.
Recommended
Recommended Products Summary
Engineering reference data for 5CSXFC5C6U23A7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSXFC6C6U23I7NES | 5CSXFC4C6U23C6N | 5CSXFC4C6U23A7N | 5CSXFC4C6U23I7N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 672-UBGA (U23, 23x23 mm) | 672-UBGA (U23, 23x23 mm) | 672-UBGA (U23, 23x23 mm) | 672-UBGA (U23, 23x23 mm) | 672-UBGA (U23, 23x23 mm) |
| Logic Elements | 85K | 110K | 40K | 40K | 40K |
| HPS Processor | Dual ARM Cortex-A9 @ 700 MHz | Dual ARM Cortex-A9 @ 700 MHz | Dual ARM Cortex-A9 @ 700 MHz | Dual ARM Cortex-A9 @ 700 MHz | Dual ARM Cortex-A9 @ 700 MHz |
| DSP Blocks | 87 | 112 | 66 | 66 | 66 |
| Transceivers (3.125 Gbps) | 6 | 6 | 6 | 6 | 6 |
| Speed Grade | A7 | I7 | C6 | A7 | I7 |
| User I/O (FPGA fabric) | 145 | 145 | 224 | 224 | 224 |
| Embedded Memory (Kbits) | 4,450 | 5,570 | 2,700 | 2,700 | 2,700 |
| Unit Price (USD, qty 1) | 77.55 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Larger fabric than the C4 family at the same speed grade (vs 5CSXFC4C6U23A7N)
- Lower-cost A7 speed grade vs the I7 industrial variant (vs 5CSXFC6C6U23I7NES)
- True SoC integration with hard ARM cores (vs FPGA-only parts (e.g. 5CGXBC series))
Design Notes
The Cyclone V SX SoC FPGA requires multiple separate supply rails: a 1.1 V core (VCC), 1.1 V HPS core, 1.8 V/2.5 V/3.3 V I/O banks, 1.5 V DDR3, 2.5 V transceiver (VCCA_GXB), and a 1.0 V/1.1 V PLL analog supply. Decouple each rail with a 0.1 uF X7R ceramic capacitor adjacent to every supply pin plus bulk capacitors on each rail plane. The SmartVoltage and POR sequencing requirements of the HPS are documented in the Cyclone V device datasheet power-management section; failing to sequence the HPS and FPGA rails correctly can lock the device or cause configuration failures at power-up.
Route the six 3.125 Gbps transceiver channels with 100 ohm differential impedance, length matching within the budget specified in the Cyclone V SX transceiver user guide, and continuous reference planes on each layer. Place the transceiver reference clock as close as possible to the GXB_REFCLK pins, and isolate it from switching signals. Use the BGA escape routing with via-in-pad or microvia structures for the 672-UBGA breakout, with at least 4 PCB layers for signal integrity and 6+ layers for full transceiver compliance.
Estimated: at full logic utilization (~85% LE), six active transceivers, and 700 MHz HPS, the 5CSXFC5C6U23A7N may dissipate 3-5 W. The 672-UBGA package relies on thermal balls and a thermal pad exposed on the PCB for heat removal. Place an array of thermal vias under the central BGA thermal balls to a copper inner plane, and consider a small heatsink for sealed industrial enclosures. Verify with the Quartus Prime Early Power Estimator before final layout.
Common pitfalls with Cyclone V SX designs include: (1) forgetting to assign MSEL[4:0] pins for the desired configuration mode (AS x4, JTAG, etc.), causing configuration failure; (2) not connecting unused transceiver inputs to ground through 1 nF caps as required by Intel; (3) treating HPS and FPGA clocks as one domain - the HPS requires its own oscillator and PLL configuration distinct from the FPGA fabric PLLs; (4) overlooking the HPS reset and warm/cold boot pin requirements, which can prevent the Cortex-A9 from booting Linux.
Compliance Information
RoHS and lead-free per Cyclone V device datasheet and Intel/Altera product page. AEC-Q100 qualification status: not declared for this OPN - automotive customers should contact Intel for AEC-Q100 screening options. Halogen-free status not explicitly stated in verified data.
