A3P400-FG144 vs A3P250-FG144T Comparison
Detailed side-by-side comparison of A3P400-FG144 by Microchip Technology and A3P250-FG144T by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Microchip Technology
A3P400-FG144 - 55K Logic Cell ProASIC3 Flash FPGA | Microchip
A3P400-FG144 ✓ ActiveMicrochip Technology
A3P250-FG144T - ProASIC3 250K-Gate Flash FPGA | Microchip
A3P250-FG144T ✓ ActiveSpecification Comparison
| Parameter | A3P400-FG144 | A3P250-FG144T |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Device Type | ProASIC3 Flash Field-Programmable Gate Array (FPGA) | — |
| Logic Cells | 55,296 | — |
| System Gates | 1 M | — |
| True Dual-Port SRAM | 144 kbits | — |
| User I/Os (Device) | 300 | — |
| User I/Os (FG144 Package) | 97 | — |
| Package | FG144, 144-ball plastic BGA (FBGA), 17 x 17 mm, 1.0 mm pitch | 144-Ball FBGA (13 x 13 mm, 1 mm pitch, 1.45 mm height) |
| Ball Count | 144 | — |
| Process Technology | 130 nm, 7-layer metal (6 copper), flash-based CMOS | 130 nm Flash |
| Configuration Memory | On-chip non-volatile flash, single-chip solution | Non-volatile Flash (single-chip, instant-on) |
| Configuration Method | Flash, reprogrammable (IEEE 1532/JTAG in-system programming) | — |
| Live at Power-Up | Supported, Level 0 | — |
| I/O Banks | 4 | — |
| Embedded Soft ARM Support | Optional in ProASIC3 family | — |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | [DATA_NEEDED: operating temperature range] | — |
| Core Supply Voltage | [DATA_NEEDED: core supply voltage] | 1.5 V |
| I/O Standards | [DATA_NEEDED: supported I/O standards] | — |
| Speed Grade | [DATA_NEEDED: speed grade of A3P400-FG144] | — |
| RoHS Status | [DATA_NEEDED: RoHS declaration] | RoHS Non-Compliant (per DigChip) |
| Family | — | ProASIC3 Flash FPGA |
| Number of Gates | — | 250,000 |
| Configurable Logic Blocks (CLBs) | — | 6144 |
| Logic Elements (LEs) | — | 3K LEs |
| Maximum System Frequency | — | 231 MHz |
| Number of User I/Os | — | 97 |
| Temperature Grade | — | Automotive (T suffix) |
| Lead Free Status | — | Contains Lead (per DigChip) |
| Packaging | — | Tray |