A3P250-FG144T - ProASIC3 250K-Gate Flash FPGA | Microchip
MPN: A3P250-FG144T β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $34.73 | $34.73 |
| 10 | $33.5 | $335.00 |
| 100 | $31.8 | $3,180.00 |
| 500 | $30.1 | $15,050.00 |
| 1,000 | $28.6 | $28,600.00 |
Drop-in alternatives for A3P250-FG144T β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
A3P250-FGG144T
β Drop-Inπ Reference alternative (not in catalog)
A3P250-FG144I
β Drop-Inπ Reference alternative (not in catalog)
A3P250-1FG144T
β Drop-Inβ In Stock
$28.9 / Unit
View Datasheet βA3P250-1FGG144T
β Drop-Inβ In Stock
$19.2 / Unit
View Datasheet βA3P250-FG144
β Drop-Inπ Reference alternative (not in catalog)
A3P250-FGG144I
β Drop-Inβ In Stock
$14.06 / Unit
View Datasheet βA3P250-FG144T Maximum Ratings & Electrical Characteristics
| Family | ProASIC3 Flash FPGA |
| Number of Gates | 250,000 |
| Configurable Logic Blocks (CLBs) | 6144 |
| Logic Elements (LEs) | 3K LEs |
| Maximum System Frequency | 231 MHz |
| Process Technology | 130 nm Flash |
| Core Supply Voltage | 1.5 V |
| Number of User I/Os | 97 |
| Package | 144-Ball FBGA (13 x 13 mm, 1 mm pitch, 1.45 mm height) |
| Mounting Type | Surface Mount |
| Configuration Memory | Non-volatile Flash (single-chip, instant-on) |
| Temperature Grade | Automotive (T suffix) |
| Lead Free Status | Contains Lead (per DigChip) |
| RoHS Status | RoHS Non-Compliant (per DigChip) |
| Packaging | Tray |
A3P250-FG144T 144-ball fbga (13 x 13 mm, 1 mm pitch, 1.45 mm height) Pin Configuration Guide
Complete pinout information for A3P250-FG144T (144-ball fbga (13 x 13 mm, 1 mm pitch, 1.45 mm height) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3P250-FG144T.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3P250-FG144T is suitable for 6 applications: Automotive Body and Powertrain Control, Industrial Motor Control and Automation, Portable and Battery-Powered Instrumentation, Secure Embedded Control Systems, Test and Measurement Equipment, Communications and Interface Bridge Logic.
Automotive Body and Powertrain Control
The A3P250-FG144T is designed for automotive ECUs: the datasheet identifies it explicitly as part of the Automotive ProASIC3 Flash Family with the T temperature suffix. Its 250K gates and 6144 CLBs provide enough capacity for body-control logic, CAN/LIN glue logic, gateways, and powertrain supervisory functions, while 97 user I/Os interface sensors, lamps, and actuators directly. The non-volatile flash fabric delivers instant-on operation - logic is functional within microseconds of key-on, eliminating external boot ROM and its failure modes. Configuration security from flash cells protects against firmware cloning in fielded vehicles. Implemented in Libero SoC with timing closure at up to 231 MHz, it suits 12V automotive rails with appropriate level-shifting on I/O banks.
Recommended
Industrial Motor Control and Automation
In industrial drives, PLC I/O modules, and motion controllers, the A3P250-FG144T provides deterministic parallel logic that microcontrollers cannot match: PWM generation, quadrature decoding, and safety interlock logic execute in hardware at up to 231 MHz. The flash-based single-chip architecture removes the configuration device required by SRAM FPGAs, improving uptime in electrically noisy factory environments where a failed boot sequence means a stopped line. With 97 I/Os in a 13 x 13 mm 144-FBGA, it consolidates discrete glue logic, reducing BOM count and board area. The 1.5 V core keeps dynamic power low for fanless industrial designs, and live reprogrammability allows field firmware updates without suspending the whole system.
Recommended
Portable and Battery-Powered Instrumentation
The A3P250-FG144T's 1.5 V core on a 130 nm flash process yields low static power, important in handheld test equipment, battery data loggers, and portable medical diagnostic devices. Instant-on flash configuration means the instrument is ready the moment power is applied - no multi-hundred-millisecond SRAM boot - which improves user experience and enables duty-cycled designs that cut power between measurements. The compact 144-ball FBGA (13 x 13 mm, 1.45 mm height) fits space-limited handheld PCBs, while 97 I/Os drive displays, keypads, and sensor front ends. Its single-chip nature also simplifies mechanical sealing of the enclosure by removing external configuration memory and its connectors.
Recommended
Secure Embedded Control Systems
Flash-based FPGAs resist configuration readback attacks: unlike SRAM FPGAs whose bitstream sits in an external PROM, the A3P250-FG144T stores configuration inside the chip, so the design never traverses a bus during boot. This makes it a strong fit for secure access controllers, encryption key handling glue logic, industrial anti-counterfeiting modules, and defense-adjacent control boards. The 250K-gate capacity hosts AES-style datapaths alongside control state machines, and 231 MHz system performance supports time-critical authentication logic. Because the device is also live reprogrammable, key-update state machines can be fielded without returning hardware. Design implementation in Libero SoC includes FlashLock security features of the ProASIC3 family.
Recommended
Test and Measurement Equipment
Bench instruments, protocol analyzers, and automated test fixtures benefit from the A3P250-FG144T's deterministic hardware timing: trigger chains, time-to-digital logic, and channel formatting run without software jitter at clock rates up to 231 MHz. The 97 user I/Os with registered I/O cells support dense channel counts in a 13 x 13 mm footprint, and the automotive-grade temperature rating provides margin for instruments used near thermal limits. Flash configuration means the instrument presents a working front-end immediately at power-up, and IEEE-style JTAG programming through Libero SoC enables test-fixture firmware updates in the field. Replacing dozens of TTL devices with one FPGA also simplifies calibration documentation.
Recommended
Communications and Interface Bridge Logic
The A3P250-FG144T serves as protocol bridge and glue logic in networking and communication boards, converting between legacy interfaces and modern controllers. With 6144 CLBs and up to 231 MHz performance, it implements UART/SPI/I2C multiplexing, parallel bus adaptation, and simple framing engines in hardware. The flash fabric is instantly active at power-on, which matters in backplane systems where a slave device must answer early enumeration, and the single-chip design removes configuration PROMs that add BOM cost per node in high-volume communication hardware. The 144-FBGA with 1 mm ball pitch is reworkable with standard BGA equipment, supporting board-level service in deployed communication racks.
Recommended
Recommended Products Summary
Engineering reference data for A3P250-FG144T β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P250-FGG144T | A3P250-FG144I | A3P250-1FG144T | A3P250-FG144 |
|---|---|---|---|---|---|
| Package | 144-Ball FBGA (13 x 13 mm) | 144-Ball FBGA - same footprint | 144-Ball FBGA - same footprint | 144-Ball FBGA - same footprint | 144-Ball FBGA - same footprint |
| Brand | Microchip Technology (Microsemi/Actel) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Gates | 250,000 | 250,000 | 250,000 | 250,000 | 250,000 |
| User I/Os | 97 | 97 | 97 | 97 | 97 |
| Max System Frequency | 231 MHz | 231 MHz | 231 MHz | [DATA_NEEDED] | 231 MHz |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Temperature Grade | Automotive (T) | Automotive (T) | Industrial (I) | Automotive (T) | [DATA_NEEDED] |
| RoHS Status | Non-Compliant (contains lead, per DigChip) | Compliant (Pb-free/Green package) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Approx. Unit Price (qty 1, as of 2026-08-31) | $34.73 (LCSC) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Automotive temperature grade with standard speed performance (vs A3P250-FG144I)
- Standard speed grade at no timing penalty (vs A3P250-1FG144T)
- Cost of RoHS non-compliance is real (vs A3P250-FGG144T)
Design Notes
The 144-ball FBGA uses a 1.0 mm ball pitch on a 13 x 13 mm body with 1.45 mm height. Design the land pattern per the package mechanical drawing in the ProASIC3 datasheet and route the dense center ball breakout with via-in-pad or dog-bone fanout on at least a 4-layer board. Verify whether your assembly line's reflow profile is compatible with the FG package's lead-containing balls; if the line is RoHS-only, switch to the A3P250-FGG144T Pb-free variant, which is pin-to-pin identical.
The A3P250 core runs from 1.5 V while I/O banks use separate supplies, so plan a multi-rail power tree and budget core current from the ProASIC3 power calculator in Libero SoC using your actual design utilization and toggle rates. Decouple all VCC/VCCI/VCCA banks with the capacitor combination recommended in the datasheet power section, placing capacitors close to the ball fanout vias. Because the flash fabric is non-volatile, no configuration power sequencing or boot-current spike from an external PROM exists, simplifying supply design versus SRAM FPGAs.
Three pitfalls recur with this part. First, order the correct package suffix: FG is lead-bearing and RoHS non-compliant per DigChip, FGG is Pb-free - a compliance audit failure is a costly rework. Second, confirm speed grade against your Libero timing report before substituting a -1 grade part such as A3P250-1FG144T. Third, since this is a mature family, verify date codes and request certificates of conformance from distributors; marketplaces report stock from non-franchise sources, so qualify suppliers before production placement.
Compliance Information
Per DigChip specification summary, A3P250-FG144T contains lead and is RoHS Non-Compliant. The datasheet identifies the part as belonging to the Automotive ProASIC3 Flash Family (T suffix). For RoHS-compliant builds, use the A3P250-FGG144T Pb-free/green package variant, which FindIC confirms as a complete drop-in replacement.
