A3P600-FG256I vs A3P600-FG256 Comparison

Detailed side-by-side comparison of A3P600-FG256I by Microchip Technology and A3P600-FG256 by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Microchip Technology
A3P600-FG256I A3P600-FG256I - ProASIC3 FPGA, 600K Gates | Microchip Technology

A3P600-FG256I - ProASIC3 FPGA, 600K Gates | Microchip Technology

A3P600-FG256I ✓ Active
Microchip Technology
A3P600-FG256 A3P600-FG256 - ProASIC3 Flash FPGA 600K Gates 256-BGA | Microchip

A3P600-FG256 - ProASIC3 Flash FPGA 600K Gates 256-BGA | Microchip

A3P600-FG256 ✓ Active

Specification Comparison

Parameter A3P600-FG256I A3P600-FG256
Brand Microchip Technology Microchip Technology
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $23.10 $48.90
Product Type Field Programmable Gate Array (FPGA) —
Series ProASIC3 —
System Gates 600,000 600000
Logic Elements / VersaTiles 13,824 VersaTiles (7K logic elements per Mouser) —
Total RAM Bits 110,592 —
Number of User I/O 177 —
Core Supply Voltage 1.5 V 1.425 V to 1.575 V (1.5 V nominal)
Maximum Internal Frequency [DATA_NEEDED: accurate maximum frequency; distributor listings cite 231 MHz or 350 MHz] —
Package 256-LBGA (FBGA-256) 256-LBGA / FBGA (17x17 mm, 1 mm pitch)
Package Dimensions 17 x 17 mm, 1.6 mm height, 1 mm pitch —
Mounting Type Surface Mount Surface Mount
Operating Temperature Range [DATA_NEEDED: exact industrial temperature range (I suffix)] —
Programming Technology Nonvolatile Flash —
Reprogrammability In-system programmable —
I/O Supply Voltage Range [DATA_NEEDED: exact I/O bank voltage range] —
RoHS Status unknown RoHS non-compliant (per Microchip USA listing)
REACH Status unknown —
Lifecycle Status active per DigiKey (ships today) —
Family — ProASIC3 (Flash FPGAs)
Logic Elements — 7K LEs (VersaTiles)
Embedded SRAM — 110592 bits (True Dual-Port)
User I/O — 177
Process Technology — 130-nm, 7-layer metal (6 copper), flash-based CMOS
Maximum System Performance — Approx. 231 MHz
Configuration Technology — On-chip flash, reprogrammable, single-chip
Power-Up Behavior — Instant On Level 0 support
Operating Temperature — 0 C to 85 C (TJ)
I/O Banks — 4 (independent VCCIBx supplies)
Packaging — Tray
Manufacturer Lead Time — 8 weeks

Datasheets & Resources

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