A3P600-FG256I vs A3P600-FG256 Comparaison
Comparaison détaillée côte à côte de A3P600-FG256I par Microchip Technology et A3P600-FG256 par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
A3P600-FG256I - ProASIC3 FPGA, 600K Gates | Microchip Technology
A3P600-FG256I ✓ ActifMicrochip Technology
A3P600-FG256 - ProASIC3 Flash FPGA 600K Gates 256-BGA | Microchip
A3P600-FG256 ✓ ActifComparaison des spécifications
| Paramètre | A3P600-FG256I | A3P600-FG256 |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $23,10 | $48,90 |
| Product Type | Field Programmable Gate Array (FPGA) | — |
| Series | ProASIC3 | — |
| System Gates | 600,000 | 600000 |
| Logic Elements / VersaTiles | 13,824 VersaTiles (7K logic elements per Mouser) | — |
| Total RAM Bits | 110,592 | — |
| Number of User I/O | 177 | — |
| Core Supply Voltage | 1.5 V | 1.425 V to 1.575 V (1.5 V nominal) |
| Maximum Internal Frequency | [DATA_NEEDED: accurate maximum frequency; distributor listings cite 231 MHz or 350 MHz] | — |
| Boîtier | 256-LBGA (FBGA-256) | 256-LBGA / FBGA (17x17 mm, 1 mm pitch) |
| Package Dimensions | 17 x 17 mm, 1.6 mm height, 1 mm pitch | — |
| Type de montage | Surface Mount | Surface Mount |
| Plage de température de fonctionnement | [DATA_NEEDED: exact industrial temperature range (I suffix)] | — |
| Programming Technology | Nonvolatile Flash | — |
| Reprogrammability | In-system programmable | — |
| I/O Supply Voltage Range | [DATA_NEEDED: exact I/O bank voltage range] | — |
| Statut RoHS | unknown | RoHS non-compliant (per Microchip USA listing) |
| REACH Status | unknown | — |
| Statut du cycle de vie | active per DigiKey (ships today) | — |
| Family | — | ProASIC3 (Flash FPGAs) |
| Logic Elements | — | 7K LEs (VersaTiles) |
| Embedded SRAM | — | 110592 bits (True Dual-Port) |
| User I/O | — | 177 |
| Process Technology | — | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| Maximum System Performance | — | Approx. 231 MHz |
| Configuration Technology | — | On-chip flash, reprogrammable, single-chip |
| Power-Up Behavior | — | Instant On Level 0 support |
| Température de fonctionnement | — | 0 C to 85 C (TJ) |
| I/O Banks | — | 4 (independent VCCIBx supplies) |
| Packaging | — | Tray |
| Manufacturer Lead Time | — | 8 weeks |