A3P600L-1FGG484I vs A3P600-FGG484 Comparison

Detailed side-by-side comparison of A3P600L-1FGG484I by Microchip Technology and A3P600-FGG484 by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Microchip Technology
A3P600L-1FGG484I A3P600L-1FGG484I - ProASIC3L FPGA 600K | Microchip

A3P600L-1FGG484I - ProASIC3L FPGA 600K | Microchip

A3P600L-1FGG484I ✓ Active
Microchip Technology
A3P600-FGG484 A3P600-FGG484 - 600K Gate ProASIC3 FPGA | Microchip

A3P600-FGG484 - 600K Gate ProASIC3 FPGA | Microchip

A3P600-FGG484 ✓ Active

Specification Comparison

Parameter A3P600L-1FGG484I A3P600-FGG484
Brand Microchip Technology Microchip Technology
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $17.10 $44.75
Manufacturer Microchip Technology —
Product Type FPGA - Field Programmable Gate Array —
Series ProASIC3L —
Total System Gates 600000 —
Number of Logic Elements / Cells 13824 —
Total RAM Bits 110592 bits —
Number of I/O 235 —
Maximum Operating Frequency 350 MHz —
Core Supply Voltage 1.2 V 1.5 V
Technology CMOS 130 nm —
Package / Case 484-BGA (FBGA), 23 x 23 mm —
Number of Pins 484 —
Speed Grade -1 —
Operating Temperature Range [DATA_NEEDED: Operating Temperature Range] —
Mounting Style [DATA_NEEDED: Mounting Style] —
RoHS [DATA_NEEDED: RoHS Status] —
ECCN [DATA_NEEDED: ECCN] —
Moisture Sensitivity Level [DATA_NEEDED: MSL] [DATA_NEEDED: MSL level]
Family — ProASIC3
System Gates — 600K
Maximum System Frequency — 231 MHz
Process Technology — 130 nm CMOS
User I/O Count — 235
Package — 484-Pin FBGA (FGG484)
Mounting Type — Surface Mount
Configuration Memory — Flash-based (non-volatile, single chip)
Terminal Form — Ball
Package Shape — Square BGA
Temperature Grade — Commercial
Operating Temperature Minimum — 0 C
Operating Temperature Maximum — [DATA_NEEDED: maximum operating temperature]
RoHS Status — Lead Free
Number of Logic Elements (LEs) — [DATA_NEEDED: logic element count]
Embedded Memory — [DATA_NEEDED: embedded SRAM capacity]

Datasheets & Resources

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