A3P600-FGG484 - 600K Gate ProASIC3 FPGA | Microchip
MPN: A3P600-FGG484 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $62.5 | $62.50 |
| 10 | $58.2 | $582.00 |
| 100 | $53.4 | $5,340.00 |
| 500 | $48.9 | $24,450.00 |
| 1,000 | $44.75 | $44,750.00 |
Drop-in alternatives for A3P600-FGG484 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A3P600L-FGG484
✅ Drop-In✓ In Stock
$54.9 / Unit
View Datasheet →A3P600L-FGG484I
✅ Drop-In✓ In Stock
$41.35 / Unit
View Datasheet →A3P600-1FGG484
✅ Drop-In✓ In Stock
$52.4 / Unit
View Datasheet →A3P600-2FGG484I
✅ Drop-In✓ In Stock
$31.8 / Unit
View Datasheet →A3P600L-1FGG484
✅ Drop-In✓ In Stock
$30.4 / Unit
View Datasheet →A3P600L-1FGG484I
✅ Drop-In✓ In Stock
$17.1 / Unit
View Datasheet →A3PE600-FGG484
✅ Drop-In📋 Reference alternative (not in catalog)
A3P600-FGG484I
✅ Drop-In✓ In Stock
$55.3 / Unit
View Datasheet →A3P600-FGG484 Maximum Ratings & Electrical Characteristics
| Family | ProASIC3 |
| System Gates | 600K |
| Maximum System Frequency | 231 MHz |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| User I/O Count | 235 |
| Package | 484-Pin FBGA (FGG484) |
| Mounting Type | Surface Mount |
| Configuration Memory | Flash-based (non-volatile, single chip) |
| Terminal Form | Ball |
| Package Shape | Square BGA |
| Temperature Grade | Commercial |
| Operating Temperature Minimum | 0 C |
| RoHS Status | Lead Free |
A3P600-FGG484 square bga Pin Configuration Guide
Complete pinout information for A3P600-FGG484 (square bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3P600-FGG484.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3P600-FGG484 is suitable for 6 applications: Industrial Control and Automation, Medical Instrumentation, Military and Aerospace Subsystems, Communications Bridging and Line Cards, Secure Single-Chip Logic Integration, Test and Measurement Equipment.
Industrial Control and Automation
The A3P600-FGG484 fits industrial control and automation systems because its 600K flash-based gates provide instant-on deterministic logic at power-up, essential for safe sequencing of actuators, drives, and safety interlocks. With 235 user I/Os in the 484-ball FBGA, it can aggregate PWM generation, encoder interfaces, and fieldbus glue logic in one chip, replacing multiple ASSPs and reducing BOM count. The flash fabric also survives power cycles without reconfiguration delays that SRAM FPGAs incur. Place it between a PLC processor and I/O modules, using its VersaTile fabric for custom interface controllers; the 1.5V core keeps dynamic power modest in fanless enclosures. For designs facing -40C shop-floor conditions, use the industrial A3P600-FGG484I or A3P600L-FGG484I variants in the identical footprint.
Recommended
Medical Instrumentation
Medical diagnostic and monitoring instruments benefit from the A3P600-FGG484's non-volatile single-chip configuration: the bitstream resides in on-chip flash, so the device powers up instantly and cannot be corrupted by a missing or damaged external configuration memory - a reliability property valued in patient-facing equipment. The 600K gates accommodate signal-chain control logic, filter coefficient engines, and interface bridging for sensors and displays, while 235 I/Os support parallel ADC/DAC buses at moderate rates within the 231 MHz fabric ceiling. The 1.5V core contributes to low heat dissipation, helping meet enclosure temperature limits for handheld and benchtop devices. Designers should implement flash lock security features in Libero to protect firmware IP, and validate the commercial temperature grade against the instrument's specified operating envelope.
Recommended
Military and Aerospace Subsystems
Flash-based ProASIC3 devices have a long heritage in military and aerospace subsystems because configuration data is stored on-chip, reducing single points of failure and simplifying radiation-reliability considerations compared with external configuration flash. The A3P600-FGG484 provides 600K gates and 235 I/Os for payload interface control, telemetry formatting, and bus bridging in the 484-ball FBGA that supports high-I/O boards. Instant-on behavior removes configuration boot time during mission-critical power transitions. Note this specific MPN is the commercial temperature grade; space and defense programs typically specify the I-suffix industrial variants (A3P600-FGG484I) or higher-reliability flow parts in the same footprint, which simplifies board reuse when upgrading qualification level. Verify program flow and screening requirements with Microchip before final selection.
Recommended
Communications Bridging and Line Cards
In communications equipment, the A3P600-FGG484 serves as protocol bridging and framer glue logic between processors, PHYs, and backplanes. Its 231 MHz system performance handles parallel data-path processing for legacy TDM, SPI, and parallel LVDS-style interfaces, while 235 user I/Os in the square 484-ball FBGA provide the fan-out needed for multi-port line cards. The flash fabric makes line cards hot-insertion friendly: logic becomes active immediately when power is applied without waiting for bitstream download over a backplane. Because the fabric is deterministic and single-chip, the device also simplifies compliance documentation. Designers should budget I/O bank supply voltages carefully at the FBGA and simulate signal integrity on the fine-pitch balls; the pin-compatible A3P600-1FGG484 offers extra timing margin for tighter protocol deadlines.
Recommended
Secure Single-Chip Logic Integration
The A3P600-FGG484 is well suited to applications requiring secure, integrated custom logic because its configuration is stored in on-chip flash rather than an external readable bitstream device. This removes the classic SRAM-FPGA attack surface of bitstream interception during boot and eliminates the external configuration memory that increases board area and BOM cost. With 600K gates, designers can consolidate ASIC-replacement glue logic, state machines, and memory controllers into one 484-ball FBGA device. Microchip's flash lock and security features in the Libero flow protect design IP against readback. Typical adopters include payment terminals, secure industrial controllers, and proprietary-equipment OEMs. The instant-on fabric also aids tamper-responsive designs that must re-secure quickly after power events, provided supply-rail sequencing is engineered per the datasheet guidance.
Recommended
Test and Measurement Equipment
Benchtop and rack test instruments use the A3P600-FGG484 for timing generators, trigger logic, and data-path formatting between analog front ends and processors. The 231 MHz fabric and 235 I/Os support parallel trigger buses and multi-channel capture logic, while the flash-based configuration means instruments are ready within milliseconds of power-up - an appreciable user-experience benefit over SRAM FPGAs that require second-scale configuration. The 484-ball FBGA gives dense, high-I/O integration on instrument main boards. For high-channel-count designs, the pin-compatible higher-density A3P1000 in related packages allows logic expansion, and the -1/-2 speed grades provide timing headroom for tighter capture deadlines. Designers should verify I/O standards supported by ProASIC3 banks against ADC/DAC interface requirements during architecture definition.
Recommended
Recommended Products Summary
Engineering reference data for A3P600-FGG484 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P600L-FGG484 | A3P600-1FGG484 | A3P600-2FGG484I | A3PE600-FGG484 |
|---|---|---|---|---|---|
| Package | 484-Pin FBGA (FGG484) | 484-Pin FBGA - same | 484-Pin FBGA - same | 484-Pin FBGA - same | 484-Pin FBGA - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600K | 600K | 600K | 600K | 600K |
| Maximum System Frequency | 231 MHz | [DATA_NEEDED] | [DATA_NEEDED] | 310 MHz | 231 MHz |
| User I/O | 235 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Family / Fabric | ProASIC3 (flash) | ProASIC3L (flash, low power) | ProASIC3 (flash) | ProASIC3 (flash) | ProASIC3E (flash, enhanced memory) |
| Temperature Grade | Commercial (0 C min) | Commercial | Commercial | Industrial (-40 C) | [DATA_NEEDED] |
| Configuration | On-chip flash, single chip | On-chip flash | On-chip flash | On-chip flash | On-chip flash |
Key Differentiators
- Instant-on non-volatile flash configuration (vs SRAM-based FPGAs (external boot flash required))
- Speed-grade upgrade path in same footprint (vs A3P600-2FGG484I)
- Low-power variant availability (vs A3P600L-FGG484)
- Trade-off: modest fabric performance (vs Modern SRAM FPGAs (e.g., 28nm class))
Design Notes
The A3P600-FGG484 requires a 1.5V core supply plus I/O bank supplies (VCCI) selected per bank according to the I/O standards used. Estimated: at 600K gates with moderate utilization on a 130nm flash fabric, static and dynamic power are typically low relative to SRAM FPGAs, but confirm exact consumption in Libero SmartPower with your design utilization before sizing regulators. Sequence supplies per the ProASIC3 power-up requirements; the flash fabric is instant-on once rails are stable, and violating sequencing or ramp-rate requirements can cause I/O contention during startup.
The 484-ball FGG484 is a fine-pitch BGA: design the PCB with the manufacturer-recommended ball land pattern, via-in-pad or dogbone fanout, and follow Microchip's packaging document for ball map and keep-out zones. Route power and ground on dedicated planes with an array of decoupling capacitors (mix of 0.1 uF and bulk values) covering all VCC/VCCI/GND ball groups - BGA power delivery depends on plane integrity, not just local caps. Because BGA rework requires specialized equipment, prototype with a verified land pattern before committing to production tooling.
With 235 user I/Os on a square FBGA, group I/O by voltage domain and speed class during pin planning in Libero, keeping fast switching banks adjacent to their VCCI returns. Estimated: for interfaces above roughly 100 MHz at the edge, use series termination (22-33 ohm) and keep trace lengths matched within the datasheet skew budget; verify IBIS-based simulations rather than assuming margins. Reserve spare I/Os near critical connectors for debug and late ECOs, since FBGA changes cannot be made with hand rework.
This MPN is the commercial temperature grade (0 C minimum); selecting it for an environment reaching -40 C is a common sourcing error. Choose the I-suffix variants (A3P600-FGG484I, A3P600L-FGG484I) in the same footprint when industrial temperatures are required. Also, do not assume cross-vendor pin compatibility: despite the shared 484-ball count with some other FPGAs, ball assignments differ - only the ProASIC3/ProASIC3E FGG484 variants listed here should be treated as drop-in candidates.
Compliance Information
Mouser listing explicitly identifies A3P600-FGG484 as LEAD FREE. Formal RoHS/REACH declarations should be requested from Microchip; other compliance attributes not stated in provided data.
