A3PE3000L-1FGG484I vs A3PE3000-1FGG484I Comparison
Detailed side-by-side comparison of A3PE3000L-1FGG484I by Microchip Technology and A3PE3000-1FGG484I by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Microchip Technology
A3PE3000L-1FGG484I - ProASIC3L FPGA 3M Gates 484-BGA | Microchip
A3PE3000L-1FGG484I ✓ ActiveMicrochip Technology
A3PE3000-1FGG484I - Flash FPGA, 3M Gates | Microchip Technology
A3PE3000-1FGG484I ✓ ActiveSpecification Comparison
| Parameter | A3PE3000L-1FGG484I | A3PE3000-1FGG484I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $104.50 | $1,336.60 |
| Family | ProASIC3L | — |
| Number of Gates | 3000000 | — |
| Total RAM Bits | 516096 | — |
| Number of I/O | 341 | — |
| Supply Voltage | 1.14 V to 1.575 V | 1.5 V |
| Core Voltage (Nominal) | 1.2 V | — |
| Core Voltage Range (per datasheet) | 1.2 V to 1.5 V | — |
| Speed Grade | -1 | -1 |
| Package / Case | 484-BGA | — |
| Supplier Device Package | 484-FPBGA (23x23) | — |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40C to +100C (TJ) | 0 to 70 C (per Digchip listing; confirm I-grade limits) |
| Technology | 130 nm Flash | — |
| Programmable Type | In System Programmable (flash-based, non-volatile) | — |
| Packaging | Tray | — |
| RoHS Status | ROHS3 Compliant | Compliant (FGG green package) |
| Manufacturer Lead Time | 8 weeks | — |
| Product Status | Active | — |
| Product Family | — | ProASIC3E |
| System Gates | — | 3,000,000 (3M) |
| Logic Elements | — | 35,000 |
| Embedded SRAM | — | 504 Kbits (516,096 bits) |
| User I/O (FGG484) | — | 341 |
| Total Balls | — | 484 |
| Package | — | 484-ball FBGA, 1.0 mm pitch (FGG484) |
| Logic Family | — | CMOS |
| System Performance | — | 231 MHz |
| Process Technology | — | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| Max User I/O (Family) | — | 616 |