Microchip Technology

A3PE3000L-1FGG484I - ProASIC3L FPGA 3M Gates 484-BGA | Microchip

MPN: A3PE3000L-1FGG484I ✓ Active
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1.14 V to 1.575 V Vdss 484-BGA Package -1 Speed
From $104.5 USD / Unit
MOQ: 1 |
Price updated: 2026-09-02
Volume Pricing
Qty Unit Price Extended
1 $145 $145.00
10 $133.5 $1,335.00
100 $121 $12,100.00
500 $112 $56,000.00
1,000 $104.5 $104,500.00
ℹ️ All prices are in USD

Drop-in alternatives for A3PE3000L-1FGG484I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

A3PE3000L-1FGG484

✅ Drop-In
📦 484-BGA (FGG484)
commercial temperature grade (0C to +70C vs -40C to +100C junction), same die, same -1 speed grade

📋 Reference alternative (not in catalog)

A3PE3000L-FGG484

✅ Drop-In
Microchip Technology
📦 484-BGA (FGG484)
ProASIC3L (Low Power Flash FPGA) · 3,000,000 · 75,264 · 341 · 516,096 bits · 1.2 V to 1.5 V · 130 nm flash · Nonvolatile flash, Instant On

✓ In Stock

Contact for price

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A3PE3000-1FGG484I

✅ Drop-In
Microchip Technology
📦 484-BGA (FGG484)
ProASIC3E · 3,000,000 (3M) · 35,000 · 504 Kbits (516,096 bits) · 341 · 484 · 484-ball FBGA, 1.0 mm pitch (FGG484) · CMOS

✓ In Stock

$1336.6 / Unit

View Datasheet →

A3PE3000-2FGG484

✅ Drop-In
Microchip Technology
📦 484-BGA (FGG484)
ProASIC3E (A3PE3000) · 3,000,000 · 75,264 · 516,096 · 341 · -2 · 310 MHz · 1.5 V (1.425 V to 1.575 V)

✓ In Stock

$28.9 / Unit

View Datasheet →

A3PE3000L-2FGG484I

✅ Drop-In ⚠️ 参数待验证
📦 484-BGA (FGG484)
same low-power L silicon, faster -2 speed grade, industrial temperature; pin-to-pin compatible

📋 Reference alternative (not in catalog)

A3PE3000L-1FGG484I Maximum Ratings & Electrical Characteristics

Family ProASIC3L
Number of Gates 3000000
Total RAM Bits 516096
Number of I/O 341
Supply Voltage 1.14 V to 1.575 V
Core Voltage (Nominal) 1.2 V
Core Voltage Range (per datasheet) 1.2 V to 1.5 V
Speed Grade -1
Package / Case 484-BGA
Supplier Device Package 484-FPBGA (23x23)
Mounting Type Surface Mount
Operating Temperature -40C to +100C (TJ)
Technology 130 nm Flash
Programmable Type In System Programmable (flash-based, non-volatile)
Packaging Tray
RoHS Status ROHS3 Compliant
Manufacturer Lead Time 8 weeks
Product Status Active

A3PE3000L-1FGG484I 484-fpbga (23x23) Pin Configuration Guide

Complete pinout information for A3PE3000L-1FGG484I (484-fpbga (23x23) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

484-fpbga (23x23) package pinout diagram for A3PE3000L-1FGG484I

No detailed pinout data available for A3PE3000L-1FGG484I.

Refer to the datasheet for full pin configuration.

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for A3PE3000L-1FGG484I Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

A3PE3000L-1FGG484I is suitable for 6 applications: Portable and Battery-Powered Instrumentation, Industrial Automation and Control, Communications Line Cards, Medical Monitoring Equipment, Aerospace and Defense Subsystems, IoT Gateways and Smart Edge Nodes.

📱

Portable and Battery-Powered Instrumentation

The A3PE3000L-1FGG484I fits portable instrumentation because its 1.2V nominal core cuts dynamic power roughly in proportion to V-squared, while FlashFreeze technology reduces static power about 50% versus the standard ProASIC3 family per Microchip's datasheet. In handheld data loggers and field test instruments, the FPGA bridges sensors to processors between measurement bursts, entering FlashFreeze standby while preserving register and RAM state. With 341 user I/Os in a 23x23 mm 484-ball package, it replaces multiple glue-logic devices, and its flash fabric removes the external configuration flash, saving board area and boot energy.

🏭

Industrial Automation and Control

Industrial controllers benefit from the A3PE3000L-1FGG484I's industrial temperature rating of -40C to +100C junction and its 3 million gate fabric, which implements motion sequencing, safety interlocks, and multi-protocol I/O handling. The flash-based, non-volatile configuration means machines power up instantly without bitstream reload - critical for line restart after outages. Its 516096 RAM bits buffer sensor data locally, while the 1.14V to 1.575V supply tolerance rides through industrial rail sag. FlashFreeze mode keeps remote I/O nodes in low-power standby between polling cycles, cutting cabinet thermal load and extending service life of convection-cooled enclosures.

🌐

Communications Line Cards

In telecom and networking line cards, the A3PE3000L-1FGG484I performs framing, grooming, and board management with 341 user I/Os interfacing PHY devices and backplane connectors. The -1 speed grade supports the moderate internal clock rates of management-plane logic, while the low 1.2V core keeps thermal budgets within sealed rack enclosures. FlashFreeze enables rapid standby when cards are powered down but must hold state for fast reactivation. The single-chip flash design also improves configuration security in carrier equipment by eliminating the external bitstream flash that SRAM FPGAs require, reducing the board's attack surface.

💊

Medical Monitoring Equipment

Patient monitors and diagnostic devices exploit the A3PE3000L-1FGG484I's low static power and FlashFreeze standby to meet strict thermal limits for skin-adjacent enclosures. The flash FPGA's instant-on behavior means monitoring channels are live immediately at power-up, essential in emergency-care equipment where boot delay is unacceptable. Its 3 million gates integrate multi-channel biopotential front-end sequencing, alarm logic, and display interfaces in one device, while the industrial -40C to +100C junction range covers transport and storage extremes. ROHS3 compliance per Microchip data supports medical RoHS directives for manufactured assemblies.

✈️

Aerospace and Defense Subsystems

The ProASIC3L architecture originates from Actel/Microsemi, a supplier with a long aerospace heritage, and the flash fabric is inherently more SEU-tolerant for configuration storage than SRAM cells, making the A3PE3000L-1FGG484I attractive for avionics housekeeping, telemetry formatting, and payload interface logic. The wide -40C to +100C junction range handles unconditioned equipment bays, and single-chip non-volatile configuration avoids bootloader complexity in systems where power-up predictability is verified. Designers should perform programmatic radiation assessment for their specific mission profile, as this industrial-grade device is not inherently radiation-hardened.

🧩

IoT Gateways and Smart Edge Nodes

Edge gateways use the A3PE3000L-1FGG484I as a deterministic protocol bridge between field buses and host processors. Its 1.14V to 1.575V supply tolerance accommodates noisy shared rails, and FlashFreeze mode lets the node idle between radio wake intervals with design state intact, extending battery-backup holdup time. With 516096 RAM bits, the FPGA preprocesses sensor streams before handing data to the MCU, offloading real-time tasks. Because the fabric is flash-based, field firmware updates reprogram the device in-system without a separate configuration flash, and the ROHS3-compliant 484-ball BGA supports standard lead-free reflow assembly in volume production.

What are the key specifications of A3PE3000L-1FGG484I that engineers should know?
The A3PE3000L-1FGG484I is a Microchip ProASIC3L flash FPGA with 3 million gates, 341 user I/Os, 516096 RAM bits, and a 1.14V to 1.575V supply range in a 484-ball FPBGA (23x23 mm) package. It operates from -40C to +100C junction temperature, uses 130 nm flash technology, and is ROHS3 compliant per Microchip product data. Its -1 speed grade and FlashFreeze technology make it a low-power, non-volatile, single-chip programmable logic solution.
What is the supply voltage range of A3PE3000L-1FGG484I?
The A3PE3000L-1FGG484I operates from a 1.14V to 1.575V supply according to distributor listings, with the ProASIC3L family datasheet (DS50003268) specifying 1.2V to 1.5V core operation. The nominal core voltage is 1.2V, and I/O banks can operate as low as 1.2V. Designers should use a regulated 1.2V core rail with tight tolerance and verify I/O bank voltages against board logic standards before layout release.
What is the difference between A3PE3000L-1FGG484I and A3PE3000-1FGG484I?
The A3PE3000L-1FGG484I is the low-power ProASIC3L variant, while the A3PE3000-1FGG484I is the standard ProASIC3E device. Both offer 3 million gates and share the 484-ball FGG484 package footprint, but the L version reduces dynamic power by about 40% and static power by about 50% via FlashFreeze technology and 1.2V core operation per the ProASIC3L datasheet. The standard E device offers higher performance at 1.5V core but higher power consumption.
What is the best drop-in replacement for A3PE3000L-1FGG484I?
The closest drop-in alternative is the same-die A3PE3000L-1FGG484 (commercial temperature variant, 0C to +85C ambient versus -40C to +100C junction), which is pin-to-pin compatible in the same 484-ball package. Within Microchip's ProASIC3 family, the A3PE3000-1FGG484I also shares the 484-FBGA footprint. Cross-brand FPGAs from Lattice or Xilinx are functional alternatives only and are NOT pin-compatible drop-in replacements.
Where can I download the A3PE3000L-1FGG484I datasheet PDF?
The official datasheet is the Microchip document 'ProASIC 3L Low Power Flash FPGAs with FlashFreeze Technology' (DS50003268), available as a PDF from ww1.microchip.com. The same document covers the whole A3PE3000L family, including package mechanical drawings for the 484-ball FPBGA. Distributors such as DigiKey, Mouser, and Octopart also link to this PDF on their A3PE3000L-1FGG484I product pages for quick download.
How much does A3PE3000L-1FGG484I cost?
Pricing for the A3PE3000L-1FGG484I as of 2026-09-02 starts at approximately $145.00 USD at quantity 1, with tiered discounts of about $133.50 at 10 pieces, $121.00 at 100 pieces, $112.00 at 500 pieces, and $104.50 at 1000 pieces. Exact pricing varies by distributor and stock position; XAIPART quotes from 6 distributor channels aggregated via Octopart, so request a quote for the best current bulk price.
Where to buy A3PE3000L-1FGG484I online?
The A3PE3000L-1FGG484I can be purchased from DigiKey Electronics, Mouser Electronics, and authorized XAIPART quoting channels; Octopart lists 6 distributors carrying the part. DigiKey and Mouser frequently ship same-day from stock. For production volumes, XAIPART provides RFQ-based sourcing from franchised distributors with full traceability, and the manufacturer lead time is approximately 8 weeks per Microchip product data as of 2026-09-02.
Is A3PE3000L-1FGG484I in stock and what is the lead time?
Yes, the A3PE3000L-1FGG484I is an active part; DigiKey's listing states 'Buy now, ships today,' indicating stock availability at authorized distributors as of 2026-09-02. If distributor stock is exhausted, the manufacturer lead time is approximately 8 weeks per Microchip product information. Buyers with scheduled production should maintain safety stock or place blanket orders because flash FPGA lead times can extend during industry-wide allocation cycles.
What operating temperature does A3PE3000L-1FGG484I support?
The A3PE3000L-1FGG484I supports a junction temperature range of -40C to +100C, per distributor specifications (Microchip USA, DigiKey). The 'I' suffix denotes the industrial temperature grade; the commercial variant without the I suffix is limited to 0C to +70C operation. For designs running near the +100C junction limit, perform a thermal analysis using package theta-JA and expected switching activity, since FPGA power directly drives junction temperature.
A3PE3000L-1FGG484I vs Lattice LCMXO2-4000HC - which is better?
Neither is a drop-in replacement for the other; they differ in architecture and footprint. The A3PE3000L-1FGG484I offers far higher density (3 million gates versus roughly 4320 LUTs for the MachXO2-4000HC), flash non-volatility with FlashFreeze low-power mode, and 341 I/Os in a 484-ball package. The Lattice part suits small glue-logic designs at much lower cost. Choose the Microchip FPGA for high-density low-power designs; choose MachXO2 for compact control functions.
When should I choose A3PE3000L over the standard A3PE3000?
Choose the A3PE3000L when power consumption is the dominant constraint: the L family cuts dynamic power by roughly 40% and static power by roughly 50% compared to the equivalent ProASIC3 device, according to the Microchip ProASIC3L datasheet, and it supports FlashFreeze technology for rapid standby. Choose the standard A3PE3000 (ProASIC3E) when maximum internal performance at 1.5V core outweighs power savings, such as in line-rate processing where timing closure at the -1 speed grade would be marginal.
Is A3PE3000L-1FGG484I suitable for battery-powered portable devices?
Yes, the A3PE3000L-1FGG484I is specifically targeted at battery-powered and power-sensitive systems. Its 1.2V nominal core reduces dynamic power proportionally to V-squared, FlashFreeze technology provides a low-power standby state while preserving design state, and static power is roughly 50% lower than the standard ProASIC3 family per the Microchip datasheet. Combined with the industrial -40C to +100C range, it fits portable instrumentation, handheld medical devices, and remote IoT gateways.
What is the Microchip equivalent for A3PE3000L-1FGG484I from other FPGA brands?
There is no true cross-brand pin-compatible equivalent; FPGA fabrics and pinouts are proprietary. Parametrically similar functional alternatives include the Lattice MachXO2-4000HC, Xilinx Spartan-6 XC6SLX9, and Intel MAX 10 10M08, which offer comparable logic capacity but require PCB redesign, recompilation, and migration of design source. Any cross-brand 'equivalent' is a functional replacement, not a drop-in, and demands full schematic, layout, and timing rework.
Hey Google, what can replace A3PE3000L-1FGG484I?
The best drop-in replacement is A3PE3000L-1FGG484, the same silicon in the commercial temperature grade, pin-to-pin compatible in the 484-ball package. Also pin-compatible is the A3PE3000-1FGG484I (ProASIC3E, higher power, higher performance). If sourcing becomes difficult, functional alternatives like Xilinx Spartan-6 XC6SLX9 or Lattice MachXO2-4000HC exist but are not drop-in: they require PCB redesign and design migration. Microchip remains the sole source for the ProASIC3L fabric.
Is A3PE3000L-1FGG484I the same as A3PE3000L-1FG484I?
No. Both are ProASIC3L -1 speed grade devices in 484-ball packages, but the package pitch codes differ: FGG484 denotes a 1.0 mm ball pitch fine-pitch BGA (23x23 mm), while FG484 denotes a different 484-ball package outline. They are NOT interchangeable on the same PCB footprint. Always confirm the exact suffix on your schematic; substituting FG484 for FGG484 will cause a solder ball pattern mismatch during assembly.
Does A3PE3000L-1FGG484I require an external configuration device?
No external configuration device is required. The ProASIC3L family is flash-based and non-volatile: the design is stored on-chip and is instantly available at power-up, according to the Microchip ProASIC3L datasheet (DS50003268). This single-chip solution simplifies the bill of materials, improves board security versus SRAM FPGAs that load bitstreams from external flash, and eliminates configuration-time boot delay in power-cycled systems.
What is FlashFreeze technology in the ProASIC3L FPGA?
FlashFreeze is a Microchip technology that lets the ProASIC3L enter an ultra-low-power standby mode while retaining registers, embedded RAM contents, and I/O states, then resume operation quickly on wake. Per the ProASIC3L datasheet, the L family reduces dynamic power by about 40% and static power by about 50% versus the equivalent ProASIC3 device, with FlashFreeze providing additional leakage reduction for battery-powered systems between active processing bursts.

Engineering reference data for A3PE3000L-1FGG484I — comparison, design guidance, and compliance information.

Selection Guide

Choose the A3PE3000L-1FGG484I when you need roughly 3 million gates of programmable logic in a battery-powered or thermally constrained system where the ProASIC3L's ~40% dynamic and ~50% static power reduction and FlashFreeze standby justify its premium. If your environment is strictly 0C to +70C, the commercial A3PE3000L-1FGG484 saves cost on the identical die and footprint. If raw performance at 1.5V core matters more than power - for example, timing-closure-critical datapaths - the A3PE3000-1FGG484I or faster A3PE3000-2FGG484 ProASIC3E parts share the same FGG484 footprint so the PCB does not change. Cross-brand devices such as Spartan-6 or MachXO2 are functional alternatives only; they demand full PCB redesign and design migration. All alternatives listed here are Microchip same-footprint drop-ins, preserving layout reuse across temperature, speed, and power variants.

Comparison with Alternatives

Parameter This Product A3PE3000L-1FGG484 A3PE3000L-FGG484 A3PE3000-1FGG484I A3PE3000-2FGG484
Package 484-BGA (FGG484, 23x23 mm) 484-BGA (FGG484) - same 484-BGA (FGG484) - same 484-BGA (FGG484) - same 484-BGA (FGG484) - same
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Gate Density 3000000 3000000 3000000 3000000 3000000
Total RAM Bits 516096 516096 516096 516096 516096
User I/O 341 341 341 341 341
Supply Voltage 1.14 V to 1.575 V 1.14 V to 1.575 V 1.14 V to 1.575 V 1.425 V to 1.575 V (1.5 V core) 1.425 V to 1.575 V (1.5 V core)
Temperature Grade -40C to +100C (TJ, industrial) 0C to +70C (commercial) [DATA_NEEDED] -40C to +100C (TJ, industrial) [DATA_NEEDED]
Power Profile Low power (FlashFreeze, ~40% lower dynamic, ~50% lower static) Same low-power profile Same low-power profile Standard ProASIC3E power (higher) Standard ProASIC3E power (higher)
Speed Grade -1 -1 Base grade -1 -2 (faster)

Key Differentiators

  • Lowest power in the 3M-gate class via FlashFreeze technology (vs A3PE3000-1FGG484I)
  • Non-volatile single-chip configuration (vs Xilinx XC6SLX9 (Spartan-6))
  • Industrial temperature at same footprint (vs A3PE3000L-1FGG484)

Design Notes

Estimate the core rail budget before selecting regulators: the A3PE3000L-1FGG484I runs a 1.2V nominal core (1.14V to 1.575V range per distributor data), and dynamic power scales with V^2, so regulating at 1.2V instead of 1.5V saves roughly 36% core dynamic power. Use Microchip's Libero power calculator with your actual switching activity for accurate estimates, and reserve margin for FlashFreeze entry/exit transients.

The 484-ball FGG484 package (1.0 mm pitch, 23x23 mm) requires a fine-pitch BGA footprint with via-in-pad or dogbone escape routing; plan for at least 4 signal layers plus dedicated core and I/O ground planes. Group I/O banks so each bank's VCCI rail matches the adjacent-chip logic standard, and place bank decoupling capacitors within 2 mm of the ball. Per the ProASIC3L datasheet layout guidance, follow the recommended power-plane segmentation for core versus I/O rails.

Estimated: with the rated -40C to +100C junction limit, a design dissipating 1.5 W in the 484-FPBGA needs theta-JA low enough to hold TJ below 100C at the worst-case ambient; for example, at 60C ambient the allowable theta-JA is about (100-60)/1.5 = 26.7 C/W, typically requiring solid ground-plane copper and possibly airflow. Verify with Microchip's thermal application notes and your measured switching activity rather than worst-case toggle assumptions.

Do not substitute the FG484 package variant for the FGG484: the pitch codes differ and footprints are not interchangeable, a frequent sourcing error in the secondary market. Also confirm the temperature suffix - the commercial grade A3PE3000L-1FGG484 is drop-in only for 0C to +70C applications. Finally, since the flash fabric is one-time-programmable per security key unless reprogram mode is enabled, plan your reprogramming flow in Libero before production programming.

Compliance Information

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Unknown

ROHS3 Compliant per Microchip USA product listing. REACH, halogen-free, and conflict minerals status not stated in provided data.

Data verified on: 2026-09-02 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Microchip Technology Microsemi Actel A3PE3000L-1FGG484I ProASIC3L ProASIC3 FPGA Field Programmable Gate Array flash FPGA non-volatile programmable logic FlashFreeze technology 484-FPBGA 484-BGA RoHS ROHS3 Compliant Libero SoC 130 nm flash process Spartan-6 XC6SLX9 MachXO2 LCMXO2-4000HC A3PE3000-1FGG484I industrial temperature range static power dynamic power embedded RAM
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