AFS600-1FG256K vs AFS600-FGG256 Comparison

Detailed side-by-side comparison of AFS600-1FG256K by Microchip Technology and AFS600-FGG256 by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Microchip Technology
AFS600-1FG256K AFS600-1FG256K - 600K Fusion Mixed-Signal FPGA | Microchip

AFS600-1FG256K - 600K Fusion Mixed-Signal FPGA | Microchip

AFS600-1FG256K ✓ Active
Microchip Technology
AFS600-FGG256 AFS600-FGG256 - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-FGG256 - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-FGG256 Unknown

Specification Comparison

Parameter AFS600-1FG256K AFS600-FGG256
Brand Microchip Technology Microchip Technology
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Unknown
Device Type Fusion mixed-signal field-programmable gate array (FPGA) Fusion mixed-signal FPGA
Programmable Logic Flash-based programmable logic —
Equivalent System Gates 600,000 gates —
Logic Cells 13,824 logic cells —
User I/O 119 I/O —
Maximum Frequency 1282.05 MHz —
Core Supply Voltage 1.5 V —
Integrated Analog Configurable analog resources —
Embedded Memory Large flash memory blocks —
Clock Management Comprehensive clock generation and management circuitry —
Package 256-terminal plastic ball grid array (256-LBGA) —
Terminal Count 256 terminals —
Package Shape Square —
Terminal Pitch 1.00 mm —
Package Dimensions 17 mm x 17 mm —
Mounting Type Surface mount Surface mount
Ordering Package Option Tray —
RoHS Status [DATA_NEEDED: RoHS status] —
REACH Status [DATA_NEEDED: REACH status] —
Operating Temperature Range [DATA_NEEDED: operating temperature range] —
System Gates — 600,000 gates
Configurable Logic Cells — 13,824 cells
I/O Count — 119 I/Os
Supply Voltage — 1.5 V
Logic Family — CMOS
Process Technology — 130 nm
Metal Layers — 7 layers
Configuration Memory — Flash-based nonvolatile memory
Configuration Feature — Live at Power-Up (LAPU)
Maximum Clock Frequency — 1098.9 MHz
Operating Temperature — 0°C to 70°C
Package Type — 256-pin FBGA
Package Pitch — 1.0 mm
Packing Media — Tray
RoHS — Compliant

Datasheets & Resources

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