AFS600-2FG484I vs M7AFS600-1FG484I Comparison
Detailed side-by-side comparison of AFS600-2FG484I by Microchip Technology and M7AFS600-1FG484I by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Microchip Technology
AFS600-2FG484I - 600K Gate Mixed-Signal FPGA | Microchip
AFS600-2FG484I UnknownMicrochip Technology
M7AFS600-1FG484I - Fusion FPGA 600K Gates, 484 FBGA | Microchip
M7AFS600-1FG484I ✓ ActiveSpecification Comparison
| Parameter | AFS600-2FG484I | M7AFS600-1FG484I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Unknown | Active |
| Device Type | Fusion mixed-signal FPGA | — |
| System Gates | 600,000 gates | 600000 |
| Programmable Logic Architecture | Flash-based CMOS programmable logic | — |
| Configuration Retention | Nonvolatile when power is off | — |
| Power-Up Configuration | Live at power-up supported | — |
| Integrated Analog Capability | Configurable analog resources | — |
| Embedded Memory | Large flash memory blocks | — |
| Clock Support | Clock generation and management circuitry | — |
| Package | 484-BGA | 484-ball FBGA (FG484), 23 x 23 x 2.44 mm |
| Package Mounting Type | Surface mount | — |
| Speed Grade | -2 | 1 |
| Temperature Grade | Industrial grade | — |
| Logic Family | CMOS | CMOS |
| Number of Pins | 484 pins | — |
| Core Supply Voltage | [DATA_NEEDED: target AFS600-2FG484I supply voltage] | — |
| Operating Temperature Range | [DATA_NEEDED: target AFS600-2FG484I operating temperature range] | — |
| I/O Count | [DATA_NEEDED: target AFS600-2FG484I I/O count] | — |
| Analog ADC Count | [DATA_NEEDED: target AFS600-2FG484I ADC count] | — |
| RoHS Status | RoHS compliant | Compliant |
| Lead-Free Status | Lead free | — |
| Programmable Logic Tiles | — | 110592 |
| User I/O | — | 172 |
| Family | — | Fusion (Flash FPGA with optional ARM CoreMP7 support) |
| Process Technology | — | 130 nm, 7-layer metal, Flash-based CMOS |
| Configuration Memory | — | Nonvolatile Flash, retains program when powered off |
| Power-Up Feature | — | Live at Power-Up (LAPU) |
| Supply Voltage (Core) | — | 1.5 V |
| Ball Pitch | — | 1.0 mm |
| Operating Temperature | — | Industrial, -40C to +85C |
| Mounting Type | — | Surface Mount |
| Embedded Processor Support | — | ARM CoreMP7 |