AFS600-2FG484I vs M7AFS600-1FG484I Comparaison
Comparaison détaillée côte à côte de AFS600-2FG484I par Microchip Technology et M7AFS600-1FG484I par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
AFS600-2FG484I - 600K Gate Mixed-Signal FPGA | Microchip
AFS600-2FG484I UnknownMicrochip Technology
M7AFS600-1FG484I - Fusion FPGA 600K Gates, 484 FBGA | Microchip
M7AFS600-1FG484I ✓ ActifComparaison des spécifications
| Paramètre | AFS600-2FG484I | M7AFS600-1FG484I |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Unknown | Actif |
| Device Type | Fusion mixed-signal FPGA | — |
| System Gates | 600,000 gates | 600000 |
| Programmable Logic Architecture | Flash-based CMOS programmable logic | — |
| Configuration Retention | Nonvolatile when power is off | — |
| Power-Up Configuration | Live at power-up supported | — |
| Integrated Analog Capability | Configurable analog resources | — |
| Embedded Memory | Large flash memory blocks | — |
| Clock Support | Clock generation and management circuitry | — |
| Boîtier | 484-BGA | 484-ball FBGA (FG484), 23 x 23 x 2.44 mm |
| Package Mounting Type | Surface mount | — |
| Speed Grade | -2 | 1 |
| Temperature Grade | Industrial grade | — |
| Logic Family | CMOS | CMOS |
| Nombre de broches | 484 pins | — |
| Core Supply Voltage | [DATA_NEEDED: target AFS600-2FG484I supply voltage] | — |
| Plage de température de fonctionnement | [DATA_NEEDED: target AFS600-2FG484I operating temperature range] | — |
| I/O Count | [DATA_NEEDED: target AFS600-2FG484I I/O count] | — |
| Analog ADC Count | [DATA_NEEDED: target AFS600-2FG484I ADC count] | — |
| Statut RoHS | RoHS compliant | Compliant |
| Lead-Free Status | Lead free | — |
| Programmable Logic Tiles | — | 110592 |
| User I/O | — | 172 |
| Family | — | Fusion (Flash FPGA with optional ARM CoreMP7 support) |
| Process Technology | — | 130 nm, 7-layer metal, Flash-based CMOS |
| Configuration Memory | — | Nonvolatile Flash, retains program when powered off |
| Power-Up Feature | — | Live at Power-Up (LAPU) |
| Supply Voltage (Core) | — | 1.5 V |
| Ball Pitch | — | 1.0 mm |
| Température de fonctionnement | — | Industrial, -40C to +85C |
| Type de montage | — | Surface Mount |
| Embedded Processor Support | — | ARM CoreMP7 |