AFS600-2FGG256I vs M7AFS600-1FGG256I Comparison
Detailed side-by-side comparison of AFS600-2FGG256I by Microchip Technology and M7AFS600-1FGG256I by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Microchip Technology
AFS600-2FGG256I - 600K Gate Mixed-Signal FPGA | Microchip
AFS600-2FGG256I ✓ ActiveMicrochip Technology
M7AFS600-1FGG256I - Fusion FPGA 600K Gates ARM CoreMP7 | Microchip
M7AFS600-1FGG256I ✓ ActiveSpecification Comparison
| Parameter | AFS600-2FGG256I | M7AFS600-1FGG256I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Product Type | Fusion mixed-signal FPGA | — |
| Number of System Gates | 600K gates | — |
| Number of I/Os | 119 I/Os | — |
| Programmable Logic Type | Flash-based programmable logic | — |
| Configuration Memory | Nonvolatile flash | Flash (nonvolatile) |
| Process Technology | 130 nm CMOS | 130 nm, 7-layer metal flash-based CMOS |
| Metal Layers | 7 layers | — |
| Integrated Resources | Configurable analog, large flash memory blocks, and clock generation and management | — |
| Package | 256-LBGA | — |
| Package Type | Square ball grid array | — |
| Number of Package Balls | 256 balls | — |
| Temperature Grade | Industrial temperature | — |
| Operating Temperature Range | -40 °C to +100 °C junction temperature | — |
| Core Supply Voltage | 1.425 V to 1.575 V | — |
| RoHS Status | RoHS Compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free Status | Lead Free | — |
| Processor Support | Optional ARM support | — |
| Input Voltage | [DATA_NEEDED: Input Voltage] | — |
| Output Voltage | [DATA_NEEDED: Output Voltage] | — |
| Maximum I/O Frequency | [DATA_NEEDED: Maximum I/O Frequency] | — |
| Embedded Memory Capacity | [DATA_NEEDED: Embedded Memory Capacity] | — |
| Analog Block Count | [DATA_NEEDED: Analog Block Count] | — |
| Family | — | Fusion (Mixed-Signal Flash FPGA) |
| System Gates | — | 600K |
| Processor Core | — | ARM CoreMP7 |
| Number of I/O | — | 119 |
| Operating Supply Voltage | — | 1.5 V |
| System Performance | — | Up to 350 MHz |
| Speed Grade | — | -1 |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| Package / Case | — | 256-Ball FBGA (FGG256) |
| Mounting Style | — | SMD/SMT |
| Packaging | — | Tray |
| Series | — | M7AFS600 |
| Live at Power-Up (LAPU) | — | Yes |
| Analog Subsystem | — | Integrated ADC, voltage/temperature monitors (per Fusion family datasheet) |