M7AFS600-1FGG256I - Fusion FPGA 600K Gates ARM CoreMP7 | Microchip
MPN: M7AFS600-1FGG256I ✓ Active| Qty | Unit Price | Extended |
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Drop-in alternatives for M7AFS600-1FGG256I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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M7AFS600-FGG256I
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View Datasheet →M7AFS600-1FGG256
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View Datasheet →M7AFS600-FGG256
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View Datasheet →M7AFS600-2FGG256
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View Datasheet →M7AFS600-1FGG256I Maximum Ratings & Electrical Characteristics
| Family | Fusion (Mixed-Signal Flash FPGA) |
| System Gates | 600K |
| Processor Core | ARM CoreMP7 |
| Number of I/O | 119 |
| Operating Supply Voltage | 1.5 V |
| Process Technology | 130 nm, 7-layer metal flash-based CMOS |
| Configuration Memory | Flash (nonvolatile) |
| System Performance | Up to 350 MHz |
| Speed Grade | -1 |
| Minimum Operating Temperature | -40 C |
| Maximum Operating Temperature | +85 C |
| Package / Case | 256-Ball FBGA (FGG256) |
| Mounting Style | SMD/SMT |
| Packaging | Tray |
| Series | M7AFS600 |
| Live at Power-Up (LAPU) | Yes |
| Analog Subsystem | Integrated ADC, voltage/temperature monitors (per Fusion family datasheet) |
M7AFS600-1FGG256I 256-ball fbga (fgg256) Pin Configuration Guide
Complete pinout information for M7AFS600-1FGG256I (256-ball fbga (fgg256) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M7AFS600-1FGG256I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M7AFS600-1FGG256I is suitable for 6 applications: Board-Level Power System Management, Industrial Control and Automation, Portable and Battery-Powered Instrumentation, Embedded Motor Control, Aerospace and Defense Subsystem Control, Test and Measurement Equipment.
Board-Level Power System Management
The M7AFS600-1FGG256I is a natural fit for board-level power system management because its Fusion analog subsystem integrates voltage monitors, an ADC, and programmable comparators alongside 600K gates of logic and the ARM CoreMP7 processor. Placed as the single system-management device, it supervises multiple power rails with millivolt-level accuracy, sequences supplies, and logs fault events without external supervisory ICs. Live at Power-Up (LAPU) flash configuration means the device begins monitoring rails within milliseconds of power application, before any host processor boots - a key advantage over SRAM FPGAs that need configuration time. The 1.5V core keeps power consumption low, while 119 I/O provide ample headroom for fault flags and control lines.
Recommended
Industrial Control and Automation
In industrial control, the -40C to +85C industrial rating of the M7AFS600-1FGG256I combined with flash-based nonvolatile configuration makes it dependable in electrically noisy factory environments. The ARM CoreMP7 processor executes communication stacks and control loops while the FPGA fabric implements deterministic state machines, PWM generators, and safety interlocks with nanosecond-level response. The integrated ADC and temperature monitors allow on-board health diagnostics, and the 119 user I/O connect sensors, actuators, and fieldbus transceivers. Because configuration is stored in flash, the controller is operational immediately after a power cycle - critical for automation equipment that must resume deterministic operation without boot delays or external configuration devices.
Recommended
Portable and Battery-Powered Instrumentation
Portable instruments benefit from the M7AFS600-1FGG256I's integration: one flash FPGA replaces a separate microcontroller, analog monitoring ICs, and configuration memory, shrinking board area and quiescent power. The 1.5V core supply minimizes dynamic power, while the 130-nm 7-layer-metal process keeps leakage low. The integrated 12-bit-class ADC and voltage/temperature monitors support battery-fuel-gauging and thermal-protection functions in firmware, and the CoreMP7 runs the user interface and data-processing tasks. With 119 I/O, a single device interfaces displays, keypads, USB bridges, and sensor front ends. The 256-ball FBGA's compact footprint suits handheld enclosures where two-sided PCB real estate is limited.
Recommended
Embedded Motor Control
The Fusion M7AFS600-1FGG256I serves motor control designs by pairing the ARM CoreMP7 processor - running field-oriented control algorithms and communication protocols - with FPGA fabric that generates precisely timed PWM with dead-band insertion and fault trip logic in hardware. The analog subsystem reads current-shunt and bus-voltage feedback through the integrated ADC, enabling closed-loop torque control without external converter ICs. Industrial temperature capability (-40C to +85C) matches drive electronics environments. Live at Power-Up ensures PWM outputs are safely tri-stated and supervision is active the instant rails rise, an important safety property versus SRAM-based FPGAs that are unconfigured for the first milliseconds after power application.
Recommended
Aerospace and Defense Subsystem Control
Flash-based, single-chip FPGAs have long been favored in aerospace and defense subsystems because they resist configuration upset from radiation-induced power disturbances and require no external configuration storage that could be a single point of failure. The M7AFS600-1FGG256I's nonvolatile flash cells and Live at Power-Up behavior make it suitable for satellite housekeeping, payload sequencing, and avionics health monitoring roles. The integrated analog monitors track rail voltages and die temperature for telemetry, while 600K gates implement protocol bridges and the CoreMP7 executes firmware-based control. Designers should verify programmatic temperature ranges and screening requirements against program specifications, as this industrial-grade variant is not automatically space-qualified.
Recommended
Test and Measurement Equipment
Bench and rack instruments use the M7AFS600-1FGG256I as an integration hub: the fabric implements trigger engines, counters, and bus interfaces (UART/SPI/I2C to host), the ARM CoreMP7 runs the measurement state machine and calibration routines, and the on-chip ADC plus voltage/temperature monitors handle self-test and thermal compensation. System performance up to 350 MHz supports fast trigger timestamping. The nonvolatile flash configuration removes configuration PROMs, improving instrument uptime, and the 119 I/O connect front-panel controls, relays, and rear-panel communication modules. The industrial temperature range keeps specifications stable in densely packed, fan-cooled chassis where internal ambient temperatures routinely exceed commercial limits.
Recommended
Recommended Products Summary
Engineering reference data for M7AFS600-1FGG256I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M7AFS600-FGG256I | M7AFS600-1FGG256 | M7AFS600-FGG256 | M7AFS600-2FGG256 | M7AFS600-2FGG256I |
|---|---|---|---|---|---|---|
| Package | 256-Ball FBGA (FGG256) | 256-Ball FBGA - same | 256-Ball FBGA - same | 256-Ball FBGA - same | 256-Ball FBGA - same | 256-Ball FBGA - same |
| Brand | Microchip Technology (Actel/Microsemi Fusion) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600K | 600K | 600K | 600K | 600K | 600K |
| User I/O | 119 | 119 | 119 | 119 | 119 | 119 |
| Speed Grade | -1 | base (faster) | -1 | base (faster) | -2 (fastest) | -2 (fastest) |
| Temperature Range | -40C to +85C (industrial) | -40C to +85C | 0C to +70C (commercial) | 0C to +70C (commercial) | 0C to +70C (commercial) | -40C to +85C |
| Processor Core | ARM CoreMP7 | ARM CoreMP7 | ARM CoreMP7 | ARM CoreMP7 | ARM CoreMP7 | ARM CoreMP7 |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Configuration Memory | Flash (nonvolatile, LAPU) | Flash (nonvolatile) | Flash (nonvolatile) | Flash (nonvolatile) | Flash (nonvolatile) | Flash (nonvolatile) |
| Packaging | Tray | Tray | Tray | Tray | Tray | Tray |
Key Differentiators
- Integrated analog subsystem with ADC and voltage/temperature monitors (vs A3P600-1FG256I)
- Embedded ARM CoreMP7 processor on-chip (vs A3P600-1FG256I)
- Lower cost speed grade for cost-optimized builds (vs M7AFS600-2FGG256I)
- Industrial temperature rating (vs M7AFS600-1FGG256)
Design Notes
Power the 1.5V core from a dedicated low-noise buck or LDO with at least 10 uF bulk and 0.1 uF per power ball of high-frequency decoupling. Estimated: at 600K gates with moderate utilization, core current is typically in the tens-to-low-hundreds of milliamp range - confirm with Libero SmartPower analysis for your design, since Fusion core current varies strongly with clock activity. I/O banks require their own 3.3V (VCCI) rails; sequence VCCI and core rails per the Fusion datasheet power-up requirements so the flash configuration state machine initializes correctly.
The 256-ball FBGA (FGG256) requires a controlled-impedance PCB with via-in-pad or dog-bone fanout on a fine pitch. Place a solid ground plane directly beneath the BGA and fan out signals with at least 4 mil trace/space. Analog inputs feeding the Fusion ADC subsystem should be routed as short as practical, shielded by ground, and kept away from switching-regulator nodes. Follow the Microchip Fusion PCB layout guidelines for ball-map fanout before finalizing the land pattern, and verify the footprint against the datasheet ball map rather than copying a third-party library symbol.
Do not confuse ordering codes: the -1 speed grade limits maximum fabric and CoreMP7 clock frequency relative to the base and -2 grades, so timing constraints that close on M7AFS600-2FGG256I may fail on this -1 part - always run static timing in Libero SoC for the exact speed grade. Also confirm the temperature suffix: M7AFS600-1FGG256 (0C to +70C) looks nearly identical on labels but is NOT rated for -40C to +85C operation. Finally, because the configuration is flash-based, in-system reprogramming requires the JTAG programming path be accessible on the board.
With 119 user I/O in a 256-ball package, group fast-switching banks together on one side of the device and keep bank return currents on a continuous ground reference. Match lengths on any source-synchronous buses above 50 MHz and use the datasheet I/O timing parameters for your speed grade (-1) when computing setup/hold budgets. Unused I/O should be configured to weak pull-up or grounded per the Fusion I/O usage guidelines to avoid floating inputs increasing noise and power.
Compliance Information
Compliance data was not published in the verified web data captured for this MPN; obtain the RoHS/REACH certificate from Microchip or the distributor before regulated manufacturing.
