AS4C512M16D4-75BCN vs K4A8G165WB-BCWE Comparison
Detailed side-by-side comparison of AS4C512M16D4-75BCN by Alliance Memory and K4A8G165WB-BCWE by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Alliance Memory
AS4C512M16D4-75BCN
AS4C512M16D4-75BCN - 8Gb DDR4 SDRAM 2666MT/s | Alliance Memory
AS4C512M16D4-75BCN β ActiveSamsung Electronics
K4A8G165WB-BCWE
K4A8G165WB-BCWE - 8Gb DDR4 SDRAM 3200Mbps 1.2V | Samsung
K4A8G165WB-BCWE β ActiveSpecification Comparison
| Parameter | AS4C512M16D4-75BCN | K4A8G165WB-BCWE |
|---|---|---|
| Brand | Alliance Memory | Samsung Electronics |
| Category | DRAM | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $7.75 | $6.55 |
| Memory Type | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8 Gbit | 8 Gb |
| Organization | 512M x 16 | 512M x 16 |
| Data Rate | 2666 MT/s (DDR4-2666) | 3200 Mbps |
| Clock Frequency | 1.333 GHz | β |
| Supply Voltage | 1.2 V | 1.2 V |
| CAS Latency | 18 | β |
| Access Time | 18 ns | β |
| Number of Banks | 16 | β |
| Prefetch Architecture | 8n | β |
| Interface | Parallel | Parallel |
| Package | 96-FBGA (7.5 mm x 13 mm) | 96FBGA |
| Operating Temperature Range | 0C to +95C (Commercial) | β |
| Mounting Type | Surface Mount (FBGA) | Surface Mount |
| Packaging | Tray | β |
| Refresh Modes | Auto-refresh, Self-refresh | β |
| On-Die Termination | Yes (ODT) | β |
| RoHS Status | [DATA_NEEDED: RoHS status] | Compliant |
| Standby Power | [DATA_NEEDED: standby power] | β |
| Access Time (CAS Latency) | β | 19 ns |
| Operating Temperature | β | 0C to +85C |
| Burst Length | β | 8 |
| Bank Group Architecture | β | Yes |
| On-Die Termination (ODT) | β | Yes, dynamic ODT with ZQ calibration |
| Functions | β | Auto precharge, asynchronous reset, CRC, data mask |
| Lead Free | β | Yes |