ATSAM3S1CB-CUR vs ATSAM3S2CA-CUR Comparison
Detailed side-by-side comparison of ATSAM3S1CB-CUR by Microchip Technology and ATSAM3S2CA-CUR by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Microchip Technology
ATSAM3S1CB-CUR - 64MHz Cortex-M3 MCU 64KB Flash | Microchip
ATSAM3S1CB-CUR ✓ ActiveMicrochip Technology
ATSAM3S2CA-CUR - 64MHz Cortex-M3 MCU 128KB Flash | Microchip
ATSAM3S2CA-CUR ✓ ActiveSpecification Comparison
| Parameter | ATSAM3S1CB-CUR | ATSAM3S2CA-CUR |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | Active |
| Core Processor | ARM Cortex-M3 | ARM Cortex-M3 (32-bit) |
| Core Size | 32-Bit | 32-Bit |
| Maximum Clock Speed | 64 MHz | — |
| Flash Memory | 64 KB (64K x 8) | — |
| SRAM | 16 KB (16K x 8) | 32 KB |
| Supply Voltage Range | 1.62 V to 3.6 V | 1.62 V to 3.6 V |
| Series | SAM3S | — |
| Package | 100-TFBGA (9x9 mm) | 100-TFBGA (9x9 mm) |
| Mounting Type | Surface Mount | Surface Mount |
| Number of Terminals | 100 | — |
| Terminal Form | Ball (BGA) | — |
| ADC Resolution | 12-bit (10-bit and 12-bit options in family) | 10-bit / 12-bit |
| DMA | Yes | — |
| Temperature Grade | Industrial | — |
| Supplier Device Package | 100-TFBGA (9x9) | — |
| Maximum Clock Frequency | — | 64 MHz |
| Flash Program Memory | — | 128 KB (128K x 8) |
| Supply Voltage (Typical) | — | 1.8 V / 3.3 V |
| Operating Temperature | — | -40C to +85C |
| Number of I/O | — | 79 |
| DAC Resolution | — | 12-bit |
| Connectivity | — | HSMCI, I2C, I2S, IrDA, SPI, SSC, TWI, UART, USART, USB |
| Core Speed (DMIPS) | — | ~1.25 DMIPS/MHz (ARM Cortex-M3) |
| Technology | — | CMOS |
| RoHS Status | — | Compliant (per JLCPCB listing) |