ATSAM3S1CB-CUR - 64MHz Cortex-M3 MCU 64KB Flash | Microchip
MPN: ATSAM3S1CB-CUR β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.18 | $4.18 |
| 10 | $3.9 | $39.00 |
| 100 | $3.25 | $325.00 |
| 500 | $2.55 | $1,275.00 |
| 1,000 | $1.74 | $1,740.00 |
ATSAM3S1CB-CUR Overview
A microcontroller (MCU) is a single integrated circuit that combines a processor core, memory, and peripherals into one chip, forming the lowest tier of the embedded processing hierarchy (MCU -> embedded processor -> system-on-chip). The SAM3S family belongs to Microchip (formerly Atmel) ARM-based flash MCU portfolio, positioning it as a mid-range 32-bit solution between small 8-bit MCUs and application processors.
Key features include the ARM Cortex-M3 core with a 3-stage pipeline and Harvard architecture, operation from a single 1.62V to 3.6V supply, and integrated analog peripherals including a 12-bit ADC (the family also offers 10-bit and 12-bit converter options per LCSC data). The -CUR suffix denotes the industrial temperature range in the lead-free TFBGA ball-grid-array package suitable for compact, high-density boards.
From an architecture standpoint, the Cortex-M3 core delivers deterministic interrupt handling via the Nested Vectored Interrupt Controller and Thumb-2 instruction efficiency. A DMA controller offloads data transfers from the CPU, according to the Microchip SAM3S1C product page, improving real-time throughput for peripheral-heavy designs. Flash memory allows in-system reprogramming, and the wide 1.62V-3.6V supply range supports battery-powered operation.
Typical applications include industrial control and automation nodes, consumer devices, and portable battery-powered instruments where 64 KB of code space and a dense 9x9 mm BGA footprint are sufficient. The 100-terminal TFBGA saves board area versus QFP alternatives.
Design consideration: verify the flash density matches your code size headroom; the pin-compatible SAM3S2C and SAM3S4C family members double and quadruple flash if 64 KB proves tight.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet. Prices as of 2026-09-19.
Drop-in alternatives for ATSAM3S1CB-CUR β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATSAM3S1CB-CUR (same form factor and footprint) β differing in ADC Resolution, Core Processor, SRAM.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
ATSAM3S2CA-CUR
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$4.89 / Unit
View Datasheet βATSAM3S4CA-CUR
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
ATSAM3S1CC-CUR
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
ATSAM3S1CA-CUR
β Drop-Inπ Reference alternative (not in catalog)
ATSAM3S1CB-CUR Maximum Ratings & Electrical Characteristics
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-Bit |
| Maximum Clock Speed | 64 MHz |
| Flash Memory | 64 KB (64K x 8) |
| SRAM | 16 KB (16K x 8) |
| Supply Voltage Range | 1.62 V to 3.6 V |
| Series | SAM3S |
| Package | 100-TFBGA (9x9 mm) |
| Mounting Type | Surface Mount |
| Number of Terminals | 100 |
| Terminal Form | Ball (BGA) |
| ADC Resolution | 12-bit (10-bit and 12-bit options in family) |
| DMA | Yes |
| Temperature Grade | Industrial |
| Supplier Device Package | 100-TFBGA (9x9) |
ATSAM3S1CB-CUR 100-tfbga (9x9) Pin Configuration Guide
Pin configuration for ATSAM3S1CB-CUR (100-tfbga (9x9) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for ATSAM3S1CB-CUR.
Refer to the datasheet for full pin configuration.
Typical Applications
ATSAM3S1CB-CUR is suitable for 6 applications: Industrial Control and Automation Nodes, Portable Battery-Powered Instruments, Consumer Embedded Devices, Data Acquisition Systems, Building Automation and Smart Sensors, Test and Measurement Accessories.
Industrial Control and Automation Nodes
The ATSAM3S1CB-CUR fits factory automation sensor and actuator nodes where a 64 MHz Cortex-M3 provides sufficient headroom for communication stacks while the 12-bit ADC samples analog process signals. Its 1.62V-3.6V supply range tolerates noisy industrial rails, and the DMA controller offloads UART and ADC transfers, keeping CPU cycles free for control-loop execution. The 100-TFBGA (9x9 mm) package packs 100 I/O-capable terminals into one square centimeter, enabling compact DIN-rail or PCB-mounted node designs. When flash requirements grow beyond 64 KB, the pin-compatible ATSAM3S2CA-CUR or ATSAM3S4CA-CUR upgrades without a board respin, protecting the layout investment over the product lifecycle.
Recommended
Portable Battery-Powered Instruments
Handheld meters and portable data loggers benefit from the ATSAM3S1CB-CUR's 1.62V minimum operating voltage, which extracts usable energy from partially discharged cells, and the Cortex-M3's multiple low-power modes for sleep between measurements. The 12-bit ADC digitizes sensor inputs without an external converter in many designs, reducing BOM cost and board area, while 64 KB Flash accommodates logging firmware and a modest display driver. The 9x9 mm TFBGA keeps the main controller within a tight enclosure footprint. Designers should profile sleep-mode current in the SAM3S datasheet tables against their duty cycle; the DMA enables burst sampling so the CPU can remain in low-power states between acquisition windows.
Recommended
Consumer Embedded Devices
Consumer products such as small appliances, toys, and fitness accessories use the ATSAM3S1CB-CUR where 32-bit processing at 64 MHz delivers responsive user interfaces and USB-class peripheral features at commodity MCU pricing (from $1.74 at the 1000-piece break per LCSC, as of 2026-09-19). The dense 100-ball TFBGA shrinks the controller footprint, enabling thinner enclosures, while the industrial temperature grade provides margin over commercial requirements for devices left in vehicles or near heat sources. The integrated 12-bit ADC supports capacitive-sensing front ends and battery monitoring. Firmware portability across the pin-compatible SAM3S1/2/4 ladder lets one hardware platform serve multiple price tiers by swapping flash density alone.
Recommended
Data Acquisition Systems
The ATSAM3S1CB-CUR serves compact data-acquisition front ends: its integrated 12-bit ADC converts sensor channels while the DMA controller streams conversion results to the 16 KB SRAM without CPU intervention, according to the Microchip SAM3S1C product description. The 64 MHz core then filters, timestamps, and packets data for upload over serial links. The 1.62V-3.6V supply simplifies powering from a shared 3.3V analog rail, and the 9x9 mm TFBGA fits distributed acquisition nodes mounted near sensors to shorten analog traces and improve noise performance. For systems needing more sample buffering, the same-package ATSAM3S4CA-CUR doubles and quadruples SRAM, extending record length without PCB changes.
Recommended
Building Automation and Smart Sensors
Networked building sensors - occupancy, temperature, and air-quality nodes - deploy the ATSAM3S1CB-CUR where a 64 MHz Cortex-M3 runs protocol firmware while the 12-bit ADC reads MEMS sensor outputs. The industrial temperature grade (-40C capable family) suits rooftop and mechanical-room deployments, and the 1.62V floor supports energy-harvesting or battery backup scenarios. The 100-terminal TFBGA provides enough I/O to drive multiple sensor interfaces and status indicators from one controller. Because the SAM3S family shares pin maps across flash densities, facility managers can standardize one PCB for corridor, rooftop, and feature-rich variants, ordering ATSAM3S1CB-CUR for basic nodes and ATSAM3S2CA-CUR where larger protocol stacks run.
Recommended
Test and Measurement Accessories
Handheld test accessories - probe interfaces, signal conditioners, and calibration modules - leverage the ATSAM3S1CB-CUR's 64 MHz throughput for real-time DSP filtering and its 12-bit ADC for measurement capture. The 16 KB SRAM buffers waveform segments for display or transfer, and DMA keeps acquisition timing deterministic by moving samples without CPU latency jitter. The compact 9x9 mm TFBGA fits probe-body and dongle form factors where a 14x14 mm LQFP would not, while the wide 1.62V-3.6V supply range adapts to instrument-internal rails. The industrial temperature grade supports bench and field use alike; verify flash utilization early, since the pin-compatible ATSAM3S4CA-CUR offers 256 KB when UI firmware grows.
Recommended
Recommended Products Summary
Engineering reference data for ATSAM3S1CB-CUR β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATSAM3S2CA-CUR | ATSAM3S4CA-CUR | ATSAM3S1CC-CUR | ATSAM3S1CA-CUR |
|---|---|---|---|---|---|
| Package | 100-TFBGA (9x9 mm) | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Max Speed | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz |
| Flash Memory | 64 KB | 128 KB | 256 KB | 64 KB | 64 KB |
| SRAM | 16 KB | 32 KB | 64 KB | 16 KB | 16 KB |
| Supply Voltage | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V |
| Temperature Grade | Industrial | Industrial | Industrial | Industrial | Industrial |
Key Differentiators
- Lowest flash density in the 100-pin SAM3S family (vs ATSAM3S2CA-CUR)
- Identical footprint across the memory ladder (vs ATSAM3S4CA-CUR)
- Densest packaging option versus QFP siblings (vs SAM3S1C in LQFP)
Design Notes
The 100-TFBGA (9x9 mm) package requires an SMT reflow process with a typical 0.8 mm ball pitch; plan PCB fanout using via-in-pad or dogbone escape patterns on outer layers. Unlike QFP, BGA joints cannot be visually inspected - specify X-ray or acoustic inspection for production qualification. Provide the standard BGA keep-out and courtyard per the SAM3S datasheet mechanical drawing, and confirm your assembler is qualified for fine-pitch BGA placement before releasing the layout.
Operate the ATSAM3S1CB-CUR from a clean 1.62V-3.6V rail; for 3.3V systems, decouple each VDD/VDDIO ball with 100 nF ceramics placed within 2 mm of the balls, plus bulk capacitance at the board entry. Verify the regulator can supply peak current during 64 MHz flash-execution with all peripherals active - consult the SAM3S datasheet power consumption tables for your mode combination. Do not exceed the 3.6V absolute rating on any I/O bank; level-shift 5V signals externally.
Budget flash headroom: 64 KB fills quickly with RTOS and protocol stacks. Because the ATSAM3S2CA-CUR and ATSAM3S4CA-CUR are pin-compatible in the same 100-TFBGA footprint, design the power and clock circuitry to the family maximum so an upward BGA swap requires no board change - though field BGA rework is impractical, so decide the density before production. Also confirm the exact -CUR ordering suffix media (tape-and-reel quantity) matches your pick-and-place setup.
Use the DMA controller for ADC and serial data movement, as Microchip's SAM3S1C product page highlights; this keeps interrupt latency deterministic for time-stamped acquisition. Keep high-speed crystal traces short and guarded, route fast I/O away from the analog ADC reference net, and provide a solid ground return under the BGA via the thermal/ground ball pattern per the datasheet layout guidelines.
Compliance Information
Compliance data not present in verified web data. The -CU suffix typically denotes Microchip lead-free/RoHS packaging; confirm on the official Microchip product page environmental data before design-in.
