ATSAMA5D27B-CUR vs ATSAMA5D27A-CUR Comparison

Detailed side-by-side comparison of ATSAMA5D27B-CUR by Microchip Technology and ATSAMA5D27A-CUR by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Microchip Technology
ATSAMA5D27B-CUR ATSAMA5D27B-CUR - 500MHz ARM Cortex-A5 MPU, 289-LFBGA | Microchip

ATSAMA5D27B-CUR - 500MHz ARM Cortex-A5 MPU, 289-LFBGA | Microchip

ATSAMA5D27B-CUR ✓ Active
Microchip Technology
ATSAMA5D27A-CUR ATSAMA5D27A-CUR - 500MHz ARM Cortex-A5 MPU | Microchip

ATSAMA5D27A-CUR - 500MHz ARM Cortex-A5 MPU | Microchip

ATSAMA5D27A-CUR ✓ Active

Specification Comparison

Parameter ATSAMA5D27B-CUR ATSAMA5D27A-CUR
Brand Microchip Technology Microchip Technology
Category Microcontrollers Microcontrollers
Lifecycle Status Active Active
Core Processor ARM Cortex-A5 —
Number of Cores 1 —
Data Bus Width 32-bit —
Maximum CPU Clock 500 MHz 500 MHz
On-Chip SRAM 128 KB —
On-Chip ROM 160 KB —
External Memory Support DDR2, DDR3L, LPDDR2, LPDDR3, QSPI, e.MMC, NAND, SD DDR2, DDR3L, LPDDR2, LPDDR3, QSPI, e.MMC
Core Supply Voltage 1.2 V (typical) —
Package 289-LFBGA (14x14 mm, 0.8 mm pitch) 289-LFBGA (14x14 mm)
Mounting Type Surface Mount Surface Mount (BGA)
Operating Temperature Range -40C to +85C (industrial) —
Graphics Support LCD TFT controller up to 1024x768 —
Camera Interface CMOS sensor (12-bit parallel) —
Ethernet 2x 10/100/1000 Mbps MAC with AVB/TSN —
USB 1x USB 2.0 High-Speed Host, 1x USB 2.0 High-Speed Device —
CAN 2x CAN-FD —
Hardware Crypto AES, SHA, TRNG, secure boot, tamper pins —
RoHS Status Compliant Compliant
Series — SAMA5D2
Core — ARM Cortex-A5 (1 core, 32-bit)
Operating Temperature — -40 C to +85 C (Industrial, MRLA marking)
Maximum Junction Temperature — 105 C
Ball Pitch — 0.8 mm
Cache — 32 KB I-cache, 32 KB D-cache
FPU / NEON — Yes (VFPv4 + NEON)
AES-OTF (On-The-Fly) — Yes
CAN-FD Controllers — 2
HSIC Interface — Yes
Peripheral Touch Controller — Yes (PTC)
Backup Mode Current — 5 uA (typ)
Packaging — Tape & Reel (TR)
MSL Level — 3
L1 Instruction Cache — 32 KB
L1 Data Cache — 32 KB
Embedded Audio Subsystem — Yes (I2S/TDM)

Datasheets & Resources

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