BSC9131NJN1HHHB557 vs BSC9131NSN7KHKB Comparison
Detailed side-by-side comparison of BSC9131NJN1HHHB557 by NXP Semiconductors and BSC9131NSN7KHKB by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
BSC9131NSN7KHKB - 800MHz e500 SoC | NXP Semiconductors
BSC9131NSN7KHKB ✗ End of LifeSpecification Comparison
| Parameter | BSC9131NJN1HHHB557 | BSC9131NSN7KHKB |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | End of Life |
| Processor Type | QorIQ Qonverge multicore baseband processor | — |
| Processor Category | Embedded MPU / communications processor | — |
| Maximum Processor Frequency | 800 MHz | — |
| Package Type | 520-FCBGA | — |
| Ball Count | 520 balls | — |
| Package Technology | Flip-chip ball grid array | — |
| Mounting Type | Surface Mount | Surface Mount |
| Core Count | [DATA_NEEDED: core count] | 1 core |
| Memory Interface | [DATA_NEEDED: memory interface type and configuration] | — |
| Network and Serial Interfaces | [DATA_NEEDED: network and serial interface list] | — |
| Input Supply Voltage | [DATA_NEEDED: input supply voltage range] | — |
| I/O Voltage | [DATA_NEEDED: I/O voltage range] | — |
| Operating Temperature Range | [DATA_NEEDED: operating temperature range] | — |
| Thermal Resistance | [DATA_NEEDED: thermal resistance] | — |
| Maximum Junction Temperature | [DATA_NEEDED: maximum junction temperature] | — |
| Physical Dimensions | [DATA_NEEDED: package dimensions] | — |
| RoHS Status | Compliant | [DATA_NEEDED: RoHS status] |
| Lifecycle Status | Active; in-stock listing reported by LCSC | End of Life |
| Manufacturer | NXP Semiconductors | — |
| Product Type | — | QorIQ Qonverge network processor SoC |
| General-Purpose CPU | — | PowerPC e500, 1 core, 32-bit |
| e500 Core Frequency | — | 800 MHz |
| DSP Processor | — | StarCore SC3850 at 1 GHz |
| Specialist Accelerator | — | MAPLE-B2F |
| Interface | — | IFC |
| External Memory Support | — | DDR3 |
| Package | — | 520-FCBGA, 21 x 21 mm |
| Pin Count | — | 520 balls |
| Operating Temperature | — | 0 C to 105 C |
| Word Size | — | 32-bit |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification status] |
| Lead-Free Status | — | [DATA_NEEDED: lead-free status] |
| Halogen-Free Status | — | [DATA_NEEDED: halogen-free status] |
| Unit Price at Quantity 1 | — | [DATA_NEEDED: unit price] |