BSC9131NJN1HHHB557 vs BSC9131NSN7KHKB مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ BSC9131NJN1HHHB557 بواسطة NXP Semiconductors و BSC9131NSN7KHKB بواسطة NXP Semiconductors. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
NXP Semiconductors
BSC9131NSN7KHKB - 800MHz e500 SoC | NXP Semiconductors
BSC9131NSN7KHKB ✗ انتهى عمره الإنتاجيمقارنة المواصفات
| المعامل | BSC9131NJN1HHHB557 | BSC9131NSN7KHKB |
|---|---|---|
| العلامة التجارية | NXP Semiconductors | NXP Semiconductors |
| الفئة | Microcontrollers | Microcontrollers |
| حالة دورة الحياة | نشط | نهاية العمر الإنتاجي |
| Processor Type | QorIQ Qonverge multicore baseband processor | — |
| Processor Category | Embedded MPU / communications processor | — |
| Maximum Processor Frequency | 800 MHz | — |
| Package Type | 520-FCBGA | — |
| Ball Count | 520 balls | — |
| Package Technology | Flip-chip ball grid array | — |
| نوع التركيب | Surface Mount | Surface Mount |
| Core Count | [DATA_NEEDED: core count] | 1 core |
| Memory Interface | [DATA_NEEDED: memory interface type and configuration] | — |
| Network and Serial Interfaces | [DATA_NEEDED: network and serial interface list] | — |
| Input Supply Voltage | [DATA_NEEDED: input supply voltage range] | — |
| I/O Voltage | [DATA_NEEDED: I/O voltage range] | — |
| نطاق درجة حرارة التشغيل | [DATA_NEEDED: operating temperature range] | — |
| المقاومة الحرارية | [DATA_NEEDED: thermal resistance] | — |
| Maximum Junction Temperature | [DATA_NEEDED: maximum junction temperature] | — |
| Physical Dimensions | [DATA_NEEDED: package dimensions] | — |
| حالة RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| حالة دورة الحياة | Active; in-stock listing reported by LCSC | End of Life |
| Manufacturer | NXP Semiconductors | — |
| Product Type | — | QorIQ Qonverge network processor SoC |
| General-Purpose CPU | — | PowerPC e500, 1 core, 32-bit |
| e500 Core Frequency | — | 800 MHz |
| DSP Processor | — | StarCore SC3850 at 1 GHz |
| Specialist Accelerator | — | MAPLE-B2F |
| الواجهة | — | IFC |
| External Memory Support | — | DDR3 |
| العلبة | — | 520-FCBGA, 21 x 21 mm |
| عدد الأطراف | — | 520 balls |
| درجة حرارة التشغيل | — | 0 C to 105 C |
| Word Size | — | 32-bit |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification status] |
| Lead-Free Status | — | [DATA_NEEDED: lead-free status] |
| Halogen-Free Status | — | [DATA_NEEDED: halogen-free status] |
| Unit Price at Quantity 1 | — | [DATA_NEEDED: unit price] |