EP1C4F324C7N vs EP1C12F324C7N Comparison

Detailed side-by-side comparison of EP1C4F324C7N by Intel and EP1C12F324C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP1C4F324C7N EP1C12F324C7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status NRND Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $25.75 $37.20
Device Family Cyclone —
Logic Elements 4000 —
Logic Array Blocks / CLBs 249 LABs —
Total RAM Bits 78336 bits (~9.6 KB) —
Maximum User I/Os 249 —
PLLs 2 —
Package Type FBGA-324 (FineLine BGA) —
Package Dimensions 19 x 19 mm, 1.0 mm ball pitch —
Core Supply Voltage 1.5 V —
Process Technology 0.13 um SRAM-based CMOS 130 nm CMOS
Speed Grade C7 (commercial, mid-speed) C7 (commercial, -40C to 85C; spec datasheet: 0C to 85C)
Internal Frequency (max) 405 MHz —
Configuration Modes Passive Serial, Active Serial, JTAG —
Embedded Multipliers Yes (DSP blocks) —
Operating Temperature 0C to +85C (commercial) [DATA_NEEDED: precise commercial temperature range per datasheet]
RoHS Status Compliant (lead-free FBGA) Compliant (N suffix = lead-free)
Mounting Type Surface Mount Surface Mount
Series — Cyclone
Family — Cyclone I
Manufacturer — Intel (formerly Altera)
Logic Elements (LEs) — 12,060
Logic Array Blocks (LABs) — 1,206
Embedded Memory (bits) — 239,616
Maximum User I/O — 249
Number of PLLs — 2
Core Voltage — 1.5 V
Operating Supply Voltage — 1.5 V to 3.3 V
Maximum Internal Frequency — 320 MHz
Package / Case — 324-BGA (FBGA-324, 19 x 19 mm, 1.0 mm pitch)
Configuration Method — AS / PS / JTAG

Datasheets & Resources

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