EP1C4F324C7N - Cyclone FPGA 4000 LEs 249 I/O FBGA-324 | Intel
MPN: EP1C4F324C7N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $29.85 | $2,985.00 |
| 250 | $27.5 | $6,875.00 |
| 500 | $25.75 | $12,875.00 |
EP1C4F324C7N Overview
A Field-Programmable Gate Array (FPGA) is a class of programmable logic device that integrates configurable logic blocks (CLBs), programmable interconnects, and dedicated memory and DSP blocks on a single silicon die. Within the broader semiconductor taxonomy, FPGAs sit beside microcontrollers and DSPs as general-purpose parallel compute engines; they are widely used for high-speed digital glue logic, interface bridging, custom data-path acceleration, and ASIC prototyping. The Cyclone family is positioned as Intel's (formerly Altera's) low-cost, high-volume FPGA line, optimizing logic density per dollar rather than raw transceiver speed.
Key specifications of the EP1C4F324C7N include 4000 logic elements organized as 249 logic blocks, 78336 bits of embedded RAM (~9.6 KB) distributed across M4K memory blocks, two phase-locked loops (PLLs) for clock management, and 249 maximum user I/Os (the maximum for the FBGA-324 package). The device is fabricated on a 1.5 V, 0.13 um SRAM-based CMOS process and supports configuration via passive serial (PS), active serial (AS), and JTAG modes. The C7 speed grade designates a commercial-temperature, mid-speed timing bin.
Architecturally, the Cyclone EP1C4 uses a sea-of-LE fabric with 4-input look-up tables (LUTs) and dedicated carry chains for arithmetic, M4K RAM blocks (4 Kbit each, configurable as SRAM, ROM, or FIFO), and embedded multipliers that accelerate DSP workloads. Two PLLs provide up to eight output clocks with multiplication and division, allowing the FPGA to derive all internal timing from a single low-frequency reference. The SRAM-based configuration cell requires an external configuration device (such as the EPCS4 or EPCS16 serial flash) at every power-up.
Typical applications for the EP1C4F324C7N include low-cost video processing (e.g., flat-panel display controllers, surveillance DVRs), industrial control and machine interfaces, communications protocol bridging (UART, I2C, SPI to high-speed parallel buses), ASIC prototyping for mid-complexity designs, and consumer audio/video equipment. The 249 user I/Os make it particularly attractive for board-level glue logic that must fan out to many parallel peripherals, while the embedded multipliers support simple FIR filters and video scaling.
When designing with this device, note that the EP1C4F324C7N is a member of the Cyclone generation first introduced in 2002 and is now considered a legacy part. Designers targeting new designs should evaluate the Cyclone IV (EP4CE) or Cyclone V (5CE) families for substantially higher logic density, lower static power, and active supply-chain support. For long-life-cycle industrial or medical systems that have an installed EP1C4 design, sourcing may require authorized distributors or the open market.
This page synthesizes distributor stock and pricing data, identifies same-package drop-in alternatives (including C6/C8 speed-grade variants and Cyclone EP1C6/EP1C12 siblings in the FBGA-324 footprint), and provides design notes not aggregated on any single manufacturer or distributor page.
Drop-in alternatives for EP1C4F324C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP1C4F324C7N (same form factor and footprint) — differing in Package, Speed Grade, RoHS Status, Operating Temperature, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1C4F324C8N
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$14.2 / Unit
View Datasheet →EP1C4F324C6N
✅ Drop-In✓ In Stock
$24.95 / Unit
View Datasheet →EP1C4F324C7
✅ Drop-In✓ In Stock
$46.8 / Unit
View Datasheet →EP1C6F324C7N
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
EP1C12F324C7N
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$37.2 / Unit
View Datasheet →EP1C3T144C7N
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$16.2 / Unit
View Datasheet →EP1C4F324C7N Maximum Ratings & Electrical Characteristics
| Device Family | Cyclone |
| Logic Elements | 4000 |
| Logic Array Blocks / CLBs | 249 LABs |
| Total RAM Bits | 78336 bits (~9.6 KB) |
| Maximum User I/Os | 249 |
| PLLs | 2 |
| Package Type | FBGA-324 (FineLine BGA) |
| Package Dimensions | 19 x 19 mm, 1.0 mm ball pitch |
| Core Supply Voltage | 1.5 V |
| Process Technology | 0.13 um SRAM-based CMOS |
| Speed Grade | C7 (commercial, mid-speed) |
| Internal Frequency (max) | 405 MHz |
| Configuration Modes | Passive Serial, Active Serial, JTAG |
| Embedded Multipliers | Yes (DSP blocks) |
| Operating Temperature | 0C to +85C (commercial) |
| RoHS Status | Compliant (lead-free FBGA) |
| Mounting Type | Surface Mount |
EP1C4F324C7N 19 x 19 mm, 1.0 mm ball pitch Pin Configuration Guide
Pin configuration for EP1C4F324C7N (19 x 19 mm, 1.0 mm ball pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1C4F324C7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP1C4F324C7N is suitable for 6 applications: Video Display Controller / LCD Panel Driver, Industrial Control / Machine Interface Glue Logic, ASIC Prototyping for Mid-Complexity Designs, Communications Protocol Bridge / Bus Converter, Consumer Audio/Video Equipment, Legacy Industrial System Maintenance / MRO.
Video Display Controller / LCD Panel Driver
The EP1C4F324C7N is well-suited to mid-complexity video pipeline designs such as flat-panel LCD controller boards and surveillance DVR front-ends. Its 4000 LEs and embedded multipliers provide enough logic to implement color-space conversion (RGB to YCbCr), scaling (nearest-neighbor or bilinear interpolation), and on-screen-display overlays, while the 249 user I/Os allow direct parallel connection to 24-bit RGB panels plus auxiliary I2C, SPI, and GPIO control channels. The 78336 bits of embedded RAM (~9.6 KB) is sufficient for line-buffer storage in 480p/576p resolutions, and the two PLLs generate pixel clocks from a 27 MHz reference. The 1.5 V core plus selectable I/O voltages (1.5/1.8/2.5/3.3 V) allow mixed-voltage interfacing to legacy panel controllers without level shifters.
Recommended
Industrial Control / Machine Interface Glue Logic
In industrial automation, the EP1C4F324C7N commonly serves as board-level glue logic aggregating multiple slow-speed serial buses (RS-232, RS-485, I2C, SPI) into a single high-speed parallel interface to a host CPU. Its 249 I/Os can simultaneously fan out to dozens of sensors, motor drivers, and indicator LEDs, while the 4000 LEs provide ample headroom for custom protocol stacks such as Modbus RTU, CAN 2.0B, or EtherCAT slave-side preprocessing. The C7 commercial speed grade is adequate for control-loop latencies in the microsecond range. The Cyclone architecture's deterministic timing (no OS jitter) makes it attractive for hard-real-time PID loops in PLC backplanes and CNC machine controllers.
Recommended
ASIC Prototyping for Mid-Complexity Designs
Engineers use the EP1C4F324C7N as a cost-effective ASIC prototype vehicle for designs targeting 5k-30k gates, often partitioned across multiple FPGAs. The 4000 LEs and embedded multipliers allow faithful RTL mapping with reasonable timing correlation to the final ASIC, while the JTAG and Active Serial configuration modes simplify in-system bring-up. The FBGA-324 package provides 249 user I/Os - sufficient for boundary-scan and logic-analyzer connectivity. Although the Cyclone generation is dated for production prototyping, it remains in use in university and research labs where its low acquisition cost (sub-30 USD at qty-500) outweighs the need for the latest fabric features.
Recommended
Communications Protocol Bridge / Bus Converter
The EP1C4F324C7N is a classic choice for protocol-bridging applications: converting between legacy parallel buses (PCI, VME, ISA-style) and modern serial interfaces (UART, SPI, I2C, USB), or aggregating multiple low-speed channels into a single high-speed link. Its 4000 LEs comfortably handle state machines for protocol translation at line rates up to 100 Mbps, while the 249 I/Os accommodate both wide parallel buses (16 or 32 bits) and multiple serial channels. The two PLLs generate independent baud-rate clocks from a single reference. Typical deployments include telecom line cards, industrial sensor hubs, and legacy-attach cards for test-and-measurement instrumentation.
Recommended
Consumer Audio/Video Equipment
In consumer electronics, the EP1C4F324C7N is found in mid-range home-theater receivers, set-top boxes, and digital audio workstations where it performs HDMI/DVI signal processing, audio sample-rate conversion, and surround-sound decoding glue logic. Its 249 I/Os allow direct connection to HDMI transmitter/receiver ICs, audio DACs/ADCs, and front-panel displays, while its 4000 LEs and embedded multipliers run FIR filters and basic audio effects in hardware. The C7 speed grade is adequate for 24-bit/96 kHz audio paths. The FBGA-324 package's 19 x 19 mm footprint fits standard 4-layer consumer PCBs with 1.0 mm-pitch BGA assembly. Although the Cyclone family is NRND, many legacy AV products still ship with it.
Recommended
Legacy Industrial System Maintenance / MRO
A primary current use case for the EP1C4F324C7N in 2026 is maintenance, repair, and overhaul (MRO) of long-life industrial systems originally designed with Cyclone generation FPGAs. Many medical imaging systems, military radio platforms, and factory-floor controllers have 15-20 year service lifetimes that outlast the original FPGA's active production window. With 249 I/Os and 4000 LEs, the EP1C4F324C7N continues to drop into replacement PCBs when authorized-distributor stock is available. Engineers performing MRO should verify date codes and lot traceability, and where possible upgrade to Cyclone IV E (EP4CE6F324C7N) on new PCBs for sustained supply continuity.
Recommended
Recommended Products Summary
Engineering reference data for EP1C4F324C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1C4F324C8N | EP1C4F324C6N | EP1C6F324C7N | EP1C12F324C7N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-324 (19 x 19 mm, 1.0 mm pitch) | FBGA-324 (19 x 19 mm, 1.0 mm pitch) - same | FBGA-324 (19 x 19 mm, 1.0 mm pitch) - same | FBGA-324 (19 x 19 mm, 1.0 mm pitch) - same | FBGA-324 (19 x 19 mm, 1.0 mm pitch) - same |
| Logic Elements | 4000 | 4000 | 4000 | 6000 | 12060 |
| Logic Array Blocks | 249 | 249 | 249 | 598 | 1206 |
| Total RAM Bits | 78336 (~9.6 KB) | 78336 | 78336 | 92160 | 239616 |
| Maximum User I/Os | 249 | 249 | 249 | 185 | 249 |
| Speed Grade | C7 | C8 (faster) | C6 (slower) | C7 | C7 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status (2026) | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Pin-compatible upgrade path within the same FBGA-324 footprint (vs EP1C3T144C7N)
- C7 commercial speed grade offers balanced cost and performance (vs EP1C4F324C8N)
- 249 maximum user I/Os for high-fanout parallel applications (vs EP1C6F324C7N)
Design Notes
Cyclone generation FPGAs are SRAM-based and lose their configuration on every power-down. A non-volatile configuration device (EPCS4, EPCS16, or EPCS64 active serial flash) is REQUIRED to load the bitstream at every power-up. Omitting this device is the most common first-power-up failure mode. For in-system reprogramming, use JTAG mode (typically via a USB-Blaster or compatible cable) - never attempt to load bitstreams via the parallel flash port on this family, as Cyclone does not support it.
The FBGA-324 package uses a 1.0 mm ball pitch with 19 x 19 mm body. PCB design requires laser-drilled microvias on 0.5 mm pitch or smaller, plus a 4-layer stack-up with continuous GND and PWR planes under the BGA. Power decoupling requires 0.1 uF and 10 uF ceramic capacitors within 3 mm of every VCCINT/VCCIO ball, with traces shorter than 5 mm. Estimated: with 1.5 V at 250 mA typical core current, expect 375 mW of core dissipation - the package thermal resistance requires 4 thermal vias in the center ball array to the inner GND plane.
Cyclone I/O banks are organized into 4 banks (1, 2, 3, 4) each with independent VCCIO. Mixing 3.3 V LVCMOS and 1.8 V LVCMOS in the same bank is forbidden - assign each bank a single I/O standard unless using bus-friendly mix. All JTAG pins (TCK, TMS, TDI, TDO) must be pulled up or down per datasheet table to avoid configuration failures; MSEL[2:0] pins select the configuration mode and must be tied to fixed logic levels (typically 000 = AS, 010 = PS, 101 = JTAG-only).
The EP1C4F324C7N is NRND as of 2026-09-06. New designs should target the Cyclone IV E (EP4CE6F324C7N) or Cyclone V (5CEBA4F324C7N) for active production support, lower static power, and modern toolchain (Quartus Prime) compatibility. If using the EP1C4F324C7N for MRO of legacy systems, secure a 12-24 month supply buffer at the time of last-buy, because authorized distributor stock will deplete without replenishment. Always verify that the Quartus II version (13.0sp1 or earlier) is available for your engineering team before committing to a redesign.
Compliance Information
RoHS-compliant per verified DigiKey distributor listing. Lead-free FBGA-324 package per verified distributor data. Halogen-free status not explicitly stated in the verified data; set to unknown. AEC-Q100 not applicable (commercial-grade FPGA, not automotive-qualified).
