EP1K30FC256-1 vs EP1K30FC256-3NAA Comparison

Detailed side-by-side comparison of EP1K30FC256-1 by Intel and EP1K30FC256-3NAA by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP1K30FC256-1 EP1K30FC256-3NAA
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status NRND Obsolete
Family ACEX-1K ACEX-1K
Logic Elements 17,280 —
Typical Gates 30,000 —
Logic Cells 1,728 —
Embedded RAM Bits 24,576 24576 bits
User I/O Pins 171 —
Logic Array Blocks (LABs) 216 —
Embedded Array Blocks (EABs) 6 —
Core Voltage (VCCINT) 2.5 V —
I/O Voltage (VCCIO) 3.3 V / 2.5 V (multi-voltage) —
Operating Temperature Grade Commercial (0C to +70C) —
Speed Grade -1 (standard, slowest in family) -3 (ordering code)
Maximum Internal Frequency 250 MHz (per family datasheet) —
Process Technology 2.5 V CMOS —
Package 256-pin FineLine BGA (FBGA) —
Mounting Type Surface Mount (BGA) Surface Mount
Configuration Interface Passive Serial / Passive Parallel / JTAG —
Programming Method SRAM-based, in-system programmable —
RoHS Status Compliant —
Product Category — FPGA - Field Programmable Gate Array
Number of Logic Elements — 1728
Number of Gates — 30000 (30K)
Number of User I/Os — 171
Maximum Internal Clock Frequency — 200 MHz
Core Supply Voltage — 2.5 V
IC Process Technology — 0.22 um
Package Type — 256-ball FBGA (FineLine BGA)
Package Form — 256-BBGA
Configuration Type — SRAM-based, external configuration device required
Operating Temperature Range — [DATA_NEEDED: operating temperature range]
I/O Supply Voltage — [DATA_NEEDED: VCCIO voltage options]
Power Dissipation — [DATA_NEEDED: typical power dissipation, design dependent]
Lead-Free / RoHS — [DATA_NEEDED: manufacturer PCN confirms RoHS status]

Datasheets & Resources

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