EP1K30FC256-2 vs EP1K30FC256-1N Comparison

Detailed side-by-side comparison of EP1K30FC256-2 by Intel and EP1K30FC256-1N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP1K30FC256-2 EP1K30FC256-1N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Family ACEX-1K ACEX-1K
Logic Elements 1,728 1,728
Typical Gates 30,000 30,000
Configurable Logic Blocks (CLBs) 216 —
On-chip RAM Bits 24,576 —
User I/O Pins 171 —
Speed Grade -2 -1
Core Voltage 2.5 V —
Process Technology 0.22 µm CMOS 0.22 um SRAM CMOS
Package 256-ball FineLine BGA (FBGA) 256-BGA (FineLine BGA, 17x17 mm)
Pin Count 256 —
Configuration Method SRAM (volatile, serial PROM or JTAG) SRAM (external PROM required)
JTAG Support Yes (IEEE 1149.1 boundary scan) —
Memory Type Dual-port EAB blocks —
Maximum Frequency 200 MHz —
Operating Temperature Grade Commercial —
Mounting Type Surface Mount (BGA) Surface Mount
RoHS Status [DATA_NEEDED: RoHS compliance status] —
Embedded RAM Bits — 24,576
Maximum User I/O — 171
Supply Voltage - Core — 2.5 V
Number of I/O Banks — [DATA_NEEDED: I/O banks]
Operating Temperature — 0C to +70C (commercial)
Programming Interface — JTAG (IEEE 1149.1)
Lead Free / RoHS — Lead free per Altera/Intel product declaration
MSL Level — [DATA_NEEDED: MSL rating]
Internal Max Frequency — up to 250 MHz (family typical)

Datasheets & Resources

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