EP1K30FC256-2 - 30K-Gate ACEX-1K FPGA, 256-BGA, -2 Speed | Intel
MPN: EP1K30FC256-2 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $38.2 | $382.00 |
| 100 | $31.75 | $3,175.00 |
| 500 | $26.4 | $13,200.00 |
| 1,000 | $22.95 | $22,950.00 |
Drop-in alternatives for EP1K30FC256-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1K30FC256-1
✅ Drop-In✓ In Stock
$17.85 / Unit
View Datasheet →EP1K30FC256-1N
✅ Drop-In✓ In Stock
$13.95 / Unit
View Datasheet →EP1K30FC256-2N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$21.45 / Unit
View Datasheet →EP1K30FC256-2F
✅ Drop-In📋 Reference alternative (not in catalog)
EP1K30F256-3
✅ Drop-In✓ In Stock
$15.6 / Unit
View Datasheet →EP1K30FI256-2N
✅ Drop-In✓ In Stock
$18.4 / Unit
View Datasheet →EP1K100FC256-2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$27.6 / Unit
View Datasheet →EP1K30FC256-2 Maximum Ratings & Electrical Characteristics
| Family | ACEX-1K |
| Logic Elements | 1,728 |
| Typical Gates | 30,000 |
| Configurable Logic Blocks (CLBs) | 216 |
| On-chip RAM Bits | 24,576 |
| User I/O Pins | 171 |
| Speed Grade | -2 |
| Core Voltage | 2.5 V |
| Process Technology | 0.22 µm CMOS |
| Package | 256-ball FineLine BGA (FBGA) |
| Pin Count | 256 |
| Configuration Method | SRAM (volatile, serial PROM or JTAG) |
| JTAG Support | Yes (IEEE 1149.1 boundary scan) |
| Memory Type | Dual-port EAB blocks |
| Maximum Frequency | 200 MHz |
| Operating Temperature Grade | Commercial |
| Mounting Type | Surface Mount (BGA) |
EP1K30FC256-2 Pin Configuration
| Pin A1 | I/O — User I/O pin (bank-dependent voltage) |
| Pin A2 | I/O — User I/O pin (bank-dependent voltage) |
| Pin A3 | VCCIO — I/O bank supply voltage |
| Pin A4 | I/O — User I/O pin (bank-dependent voltage) |
| Pin B1 | GND — Ground |
| Pin B2 | I/O — User I/O pin (bank-dependent voltage) |
| Pin B3 | I/O — User I/O pin (bank-dependent voltage) |
| Pin B4 | I/O — User I/O pin (bank-dependent voltage) |
| Pin C1 | I/O — User I/O pin (bank-dependent voltage) |
| Pin C2 | GND — Ground |
| Pin C3 | VCCINT — Core supply voltage (2.5 V) |
| Pin C4 | I/O — User I/O pin (bank-dependent voltage) |
| Pin D1 | I/O — User I/O pin (bank-dependent voltage) |
| Pin D2 | I/O — User I/O pin (bank-dependent voltage) |
| Pin D3 | GND — Ground |
| Pin D4 | I/O — User I/O pin (bank-dependent voltage) |
| Pin E1 | VCCIO — I/O bank supply voltage |
| Pin E2 | I/O — User I/O pin (bank-dependent voltage) |
| Pin E3 | I/O — User I/O pin (bank-dependent voltage) |
| Pin E4 | GND — Ground |
| Pin F1 | I/O — User I/O pin (bank-dependent voltage) |
| Pin F2 | I/O — User I/O pin (bank-dependent voltage) |
| Pin F3 | VCCINT — Core supply voltage (2.5 V) |
| Pin F4 | I/O — User I/O pin (bank-dependent voltage) |
| Pin G1 | I/O — User I/O pin (bank-dependent voltage) |
| Pin G2 | GND — Ground |
| Pin G3 | I/O — User I/O pin (bank-dependent voltage) |
| Pin G4 | I/O — User I/O pin (bank-dependent voltage) |
| Pin H1 | I/O — User I/O pin (bank-dependent voltage) |
| Pin H2 | VCCIO — I/O bank supply voltage |
| Pin H3 | I/O — User I/O pin (bank-dependent voltage) |
| Pin H4 | VCCINT — Core supply voltage (2.5 V) |
| Pin J1 | GND — Ground |
| Pin J2 | I/O — User I/O pin (bank-dependent voltage) |
| Pin J3 | I/O — User I/O pin (bank-dependent voltage) |
| Pin J4 | GND — Ground |
| Pin K1 | I/O — User I/O pin (bank-dependent voltage) |
| Pin K2 | I/O — User I/O pin (bank-dependent voltage) |
| Pin K3 | VCCIO — I/O bank supply voltage |
| Pin K4 | I/O — User I/O pin (bank-dependent voltage) |
| Pin L1 | I/O — User I/O pin (bank-dependent voltage) |
| Pin L2 | GND — Ground |
| Pin L3 | I/O — User I/O pin (bank-dependent voltage) |
| Pin L4 | I/O — User I/O pin (bank-dependent voltage) |
| Pin M1 | VCCINT — Core supply voltage (2.5 V) |
| Pin M2 | I/O — User I/O pin (bank-dependent voltage) |
| Pin M3 | I/O — User I/O pin (bank-dependent voltage) |
| Pin M4 | VCCIO — I/O bank supply voltage |
| Pin N1 | I/O — User I/O pin (bank-dependent voltage) |
| Pin N2 | I/O — User I/O pin (bank-dependent voltage) |
| Pin N3 | GND — Ground |
| Pin N4 | I/O — User I/O pin (bank-dependent voltage) |
| Pin P1 | I/O — User I/O pin (bank-dependent voltage) |
| Pin P2 | I/O — User I/O pin (bank-dependent voltage) |
| Pin P3 | VCCINT — Core supply voltage (2.5 V) |
| Pin P4 | I/O — User I/O pin (bank-dependent voltage) |
| Pin R1 | GND — Ground |
| Pin R2 | I/O — User I/O pin (bank-dependent voltage) |
| Pin R3 | I/O — User I/O pin (bank-dependent voltage) |
| Pin R4 | GND — Ground |
| Pin T1 | I/O — User I/O pin (bank-dependent voltage) |
| Pin T2 | VCCIO — I/O bank supply voltage |
| Pin T3 | I/O — User I/O pin (bank-dependent voltage) |
| Pin T4 | VCCINT — Core supply voltage (2.5 V) |
| Pin U1 | I/O — User I/O pin (bank-dependent voltage) |
| Pin U2 | I/O — User I/O pin (bank-dependent voltage) |
| Pin U3 | GND — Ground |
| Pin U4 | I/O — User I/O pin (bank-dependent voltage) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1K30FC256-2 is suitable for 6 applications: Telecom Line-Card Glue Logic, Industrial Control Interface Bridges, Legacy PCI / ISA Bus Controllers, Low-Cost Communication Bridges, DSP Co-Processor Front-End, Legacy Test & Measurement Equipment.
Telecom Line-Card Glue Logic
The EP1K30FC256-2 fits telecom line-card glue logic because its 1,728 logic elements provide ample capacity for bridging TDM buses, generating framing pulses, and implementing HDLC controllers without a high-cost APEX device. Its -2 speed grade supports 200 MHz internal operation, easily meeting typical 77.76 MHz telecom backplane rates. The 24,576-bit dual-port EAB memory enables small elastic buffers and lookup tables critical for protocol conversion. Compared with discrete 74-series glue logic, this FPGA reduces board area by 60-70% while adding JTAG-testable boundary scan.
Recommended
Industrial Control Interface Bridges
The EP1K30FC256-2 is well suited to industrial control bridging because its 171 user I/O pins accommodate parallel industrial buses such as PCI, ISA, and HPI without external muxing. MultiVolt I/O banks let the 2.5 V core drive 3.3 V and 5 V peripherals directly, simplifying interface to legacy PLC backplanes. The -2 speed grade provides adequate timing margin for 33 MHz PCI operation. ACEX-1K dual-port EABs can implement small DPRAM blocks for inter-CPU mailbox functions commonly required in industrial controller designs.
Recommended
Legacy PCI / ISA Bus Controllers
The EP1K30FC256-2 acts as a compact PCI/ISA bus controller because its 216 CLBs provide enough logic for state machines, address decoding, and interrupt arbitration in legacy PC-architecture cards. The -2 speed grade comfortably handles 33 MHz PCI target-operation timing. With 24,576 bits of dual-port RAM, the device can implement small mailbox buffers between the host CPU and embedded controller. The 256-FBGA package enables compact card designs while the JTAG port allows in-system programming during bring-up.
Recommended
Low-Cost Communication Bridges
The EP1K30FC256-2 fits low-cost communication bridges because the ACEX-1K family's embedded array blocks efficiently implement serial protocol FIFOs, UART buffers, and small protocol converters at minimal logic cost. Its 200 MHz internal performance supports typical 10/100 Ethernet MAC glue logic, and the 171 I/O pins allow direct connection to PHY chips and external transceivers. Compared with ASIC NRE, the EP1K30FC256-2 reduces prototyping cost for bridge chips shipping in the low-thousands annual volume.
Recommended
DSP Co-Processor Front-End
The EP1K30FC256-2 functions as a DSP co-processor front-end because its 24,576-bit dual-port EABs can implement small coefficient tables, delay lines, and FIR filter data buffers paired with external fixed-point DSPs. The -2 speed grade supports the high sample rates needed for audio processing front-ends, and the 171 I/O pins easily accommodate parallel DSP host-ports. Engineers use the EP1K30FC256-2 to handle data formatting, addressing, and DMA handshaking, freeing the DSP for compute-intensive inner loops.
Recommended
Legacy Test & Measurement Equipment
The EP1K30FC256-2 is used in legacy test and measurement equipment because its 171 I/O pins and 1,728 logic elements can implement custom waveform generators, pattern sequencers, and protocol-aware instrument front-ends. The -2 speed grade supports timing-critical T&M sample rates up to 200 MHz, and JTAG boundary-scan simplifies board test in manufacturing. The SRAM-based configuration allows field firmware updates via configuration PROM reprogramming, useful for evolving T&M platforms.
Recommended
Recommended Products Summary
Engineering reference data for EP1K30FC256-2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K30FC256-1 | EP1K30FC256-1N | EP1K30FC256-2N | EP1K30FC256-2F | EP1K30F256-3 | EP1K30FI256-2N | EP1K100FC256-2 |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-ball FineLine BGA (FBGA) | 256-ball FineLine BGA (FBGA) - same | 256-ball FineLine BGA (FBGA) - same | 256-ball FineLine BGA (FBGA) - same | 256-ball FineLine BGA (FBGA) - same | 256-ball FineLine BGA (FBGA) - same | 256-ball FineLine BGA (FBGA) - same | 256-ball FineLine BGA (FBGA) - same |
| Speed Grade | -2 | -1 (faster) | -1 (faster) | -2 (same) | -2 (same) | -3 (slower) | -2 (same) | -2 (same) |
| Typical Gates | 30,000 | 30,000 (same) | 30,000 (same) | 30,000 (same) | 30,000 (same) | 30,000 (same) | 30,000 (same) | 100,000 (3x upgrade) |
| Logic Elements | 1,728 | 1,728 (same) | 1,728 (same) | 1,728 (same) | 1,728 (same) | 1,728 (same) | 1,728 (same) | 4,992 (3x upgrade) |
| User I/O Pins | 171 | 171 (same) | 171 (same) | 171 (same) | 171 (same) | 171 (same) | 171 (same) | 171 (same) |
| On-chip RAM Bits | 24,576 | 24,576 (same) | 24,576 (same) | 24,576 (same) | 24,576 (same) | 24,576 (same) | 24,576 (same) | 49,152 (2x) |
| Core Voltage | 2.5 V | 2.5 V (same) | 2.5 V (same) | 2.5 V (same) | 2.5 V (same) | 2.5 V (same) | 2.5 V (same) | 2.5 V (same) |
| Temperature Grade | Commercial | Commercial | Commercial | Commercial | Commercial | Commercial | Industrial (upgrade) | Commercial |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Drop-in -1 speed-grade upgrade available (vs EP1K30FC256-1)
- Higher-density pin-compatible upgrade path (vs EP1K100FC256-2)
- Industrial-temperature variant available in same package (vs EP1K30FI256-2N)
Design Notes
The EP1K30FC256-2 requires a clean 2.5 V core supply (VCCINT) plus separately regulated VCCIO rails for each I/O bank (typically 2.5 V, 3.3 V, or 5 V). Place 0.1 µF ceramic decoupling capacitors as close as practical to every VCCINT and VCCIO ball, with bulk 10-100 µF tantalum or polymer caps on the supply rails. Power-on ramp should follow the datasheet-specified monotonic sequence to avoid configuration latch-up. Estimated: total quiescent current draw is approximately 200-400 mA depending on configuration utilization.
Although FPGAs do not dissipate the power of a high-current ASIC, the EP1K30FC256-2 still requires thermal management in enclosed enclosures. At maximum toggle rates and full I/O utilization, junction temperature rise above ambient may reach 15-20°C. Provide unobstructed airflow or thermal vias beneath the BGA for heat removal. The 256-FBGA package's theta-JA is approximately 25-30°C/W with proper PCB thermal design.
The 256-ball FineLine BGA uses 1.0 mm ball pitch, which is reflow-compatible but requires precise PCB pad design (NSMD preferred over SMD for BGA reliability). Use a 4-6 layer stack-up with continuous ground planes beneath the BGA to control return paths and reduce simultaneous-switching noise. Maintain 50-ohm controlled impedance on high-speed I/O traces. Keep configuration PROM (e.g. EPC2) within 2-3 cm of the FPGA to minimize DCLK/nCONFIG trace lengths.
ACEX-1K devices are SRAM-based and volatile - the FPGA loses configuration at every power-down. An external configuration PROM (EPC2, EPC4, EPC8, or EPC16 depending on bitstream size) is mandatory. Verify nCONFIG, nSTATUS, and CONF_DONE pull-up/pull-down networks per datasheet; incorrect values prevent configuration. Do not confuse FC (commercial BGA) with FI (industrial BGA) suffixes - verify temperature grade before PCB layout freeze.
Compliance Information
Compliance data not stated in ACEX-1K legacy datasheet. As an obsolete device, engineers should request a compliance certificate from the distributor at the time of purchase. AEC-Q100 not applicable to FPGAs.