EP1K50FC256-1N vs EP1K50FC256-3AA Comparison
Detailed side-by-side comparison of EP1K50FC256-1N by Intel and EP1K50FC256-3AA by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP1K50FC256-1N | EP1K50FC256-3AA |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $15.10 | $92.00 |
| Family | ACEX-1K | ACEX 1K Device Family (2.5V) |
| Series | ACEX-1K (2.5 V) | ACEX-1K |
| Maximum Logic Elements | 2,880 | β |
| Logic Array Blocks (LABs) | 360 | β |
| Typical Gates | 50,000 | β |
| Maximum System Gates | 199,000 | β |
| Embedded Memory (EAB) Bits | 40,960 bits | β |
| User I/O Pins | 186 | β |
| Core Supply Voltage | 2.5 V (2.375 V to 2.625 V) | β |
| Maximum Internal Frequency | 250 MHz | β |
| Process Technology | 0.22 um CMOS | 0.22 Β΅m CMOS SRAM |
| Typical Operating Current | 5 mA | β |
| Speed Grade | -1 (commercial) | -3 (faster tier) |
| Operating Temperature | 0 C to 70 C (commercial) | 0 Β°C to 70 Β°C (commercial) |
| Package | 256-ball FBGA (FineLine BGA) | 256-BGA (FBGA, 17x17 mm) |
| Mounting Type | Surface Mount | Surface Mount |
| Lead Status | Lead-free (-N suffix) | β |
| RoHS Status | Compliant | non_compliant (legacy BGA, pre-RoHS or exemption dependent on date code) |
| Programmable I/O Standards | LVTTL, LVCMOS, PCI, GTL+ | β |
| Configuration Method | SRAM-based, JTAG (IEEE 1149.1) | SRAM (volatile, requires external config device) |
| Number of Logic Elements | β | 2880 |
| Number of LABs (Logic Array Blocks) | β | 360 |
| Total RAM Bits | β | 40960 |
| Number of I/O Pins | β | 186 |
| Number of Gates | β | 50000 (typical) |
| Core Voltage | β | 2.5 V (2.375 V to 2.625 V) |
| Number of PLLs | β | 4 (per family datasheet) |
| Number of Global Clocks | β | [DATA_NEEDED: number of global clocks] |