EP1K50FC256-1N vs EP1K50FC256-3AA तुलना
विस्तृत दोनों ओर की तुलना EP1K50FC256-1N द्वारा Intel और EP1K50FC256-3AA द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP1K50FC256-1N | EP1K50FC256-3AA |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | Obsolete | Obsolete |
| Family | ACEX-1K | ACEX 1K Device Family (2.5V) |
| Series | ACEX-1K (2.5 V) | ACEX-1K |
| Maximum Logic Elements | 2,880 | — |
| Logic Array Blocks (LABs) | 360 | — |
| Typical Gates | 50,000 | — |
| Maximum System Gates | 199,000 | — |
| Embedded Memory (EAB) Bits | 40,960 bits | — |
| User I/O Pins | 186 | — |
| Core Supply Voltage | 2.5 V (2.375 V to 2.625 V) | — |
| Maximum Internal Frequency | 250 MHz | — |
| Process Technology | 0.22 um CMOS | 0.22 µm CMOS SRAM |
| Typical Operating Current | 5 mA | — |
| Speed Grade | -1 (commercial) | -3 (faster tier) |
| ऑपरेटिंग तापमान | 0 C to 70 C (commercial) | 0 °C to 70 °C (commercial) |
| पैकेज | 256-ball FBGA (FineLine BGA) | 256-BGA (FBGA, 17x17 mm) |
| माउंटिंग प्रकार | Surface Mount | Surface Mount |
| Lead Status | Lead-free (-N suffix) | — |
| RoHS स्थिति | Compliant | non_compliant (legacy BGA, pre-RoHS or exemption dependent on date code) |
| Programmable I/O Standards | LVTTL, LVCMOS, PCI, GTL+ | — |
| Configuration Method | SRAM-based, JTAG (IEEE 1149.1) | SRAM (volatile, requires external config device) |
| Number of Logic Elements | — | 2880 |
| Number of LABs (Logic Array Blocks) | — | 360 |
| Total RAM Bits | — | 40960 |
| Number of I/O Pins | — | 186 |
| Number of Gates | — | 50000 (typical) |
| Core Voltage | — | 2.5 V (2.375 V to 2.625 V) |
| Number of PLLs | — | 4 (per family datasheet) |
| Number of Global Clocks | — | [DATA_NEEDED: number of global clocks] |