EP1SGX25DF672C7N vs EP1SGX25DF672I7N Comparison

Detailed side-by-side comparison of EP1SGX25DF672C7N by Intel and EP1SGX25DF672I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP1SGX25DF672C7N EP1SGX25DF672I7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last Time Buy Obsolete
Series Stratix GX —
Logic Elements 25,660 25,660
Embedded Memory 1,944,576 bits —
Maximum User I/O 455 —
Number of Transceivers 4 —
Transceiver Data Rate (Max) 3.125 Gbps —
Core Supply Voltage 1.5 V —
Process Technology 130 nm CMOS 130 nm CMOS
Operating Temperature 0 °C to 85 °C (Commercial) 0 °C to 85 °C (industrial)
Package 672-ball FineLine BGA (FBGA-672) 672-ball FineLine BGA (FC-FBGA), 33 × 33 mm, 1 mm pitch
Package Dimensions 33 × 33 mm, 1 mm pitch —
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
Lead-Free / RoHS Yes (lead-free, per datasheet) —
Speed Grade C7 —
RoHS Status Compliant [DATA_NEEDED: rohs status]
Family — Stratix GX
CLBs — 2,566
Maximum Operating Frequency — 4385.97 MHz (logic); 4.7 MHz (combinatorial CLB delay rating)
Combinatorial Delay (CLB) — 9.48 ns max
High-Speed Transceiver Channels — 4
Transceiver Data Rate — 500 Mbps to 3.1875 Gbps per channel
Core Supply Voltage (VCCINT) — 1.5 V
Supply Voltage Range — 1.425 V to 1.575 V
Logic Family — CMOS
Lead-Free — Yes
Terminal Form — Ball (BGA)
Number of Terminals — 672

Datasheets & Resources

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