EP1SGX25DF672C7N - Stratix GX FPGA 25K LE 672-BGA | Intel / Altera
MPN: EP1SGX25DF672C7N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $385 | $385.00 |
| 10 | $350 | $3,500.00 |
| 100 | $310 | $31,000.00 |
| 500 | $275 | $137,500.00 |
| 1,000 | $245 | $245,000.00 |
Drop-in alternatives for EP1SGX25DF672C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1SGX25DF672C7N Maximum Ratings & Electrical Characteristics
| Series | Stratix GX |
| Logic Elements | 25,660 |
| Embedded Memory | 1,944,576 bits |
| Maximum User I/O | 455 |
| Number of Transceivers | 4 |
| Transceiver Data Rate (Max) | 3.125 Gbps |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm CMOS |
| Operating Temperature | 0 °C to 85 °C (Commercial) |
| Package | 672-ball FineLine BGA (FBGA-672) |
| Package Dimensions | 33 × 33 mm, 1 mm pitch |
| Mounting Type | Surface Mount (BGA) |
| Lead-Free / RoHS | Yes (lead-free, per datasheet) |
| Speed Grade | C7 |
| RoHS Status | Compliant |
EP1SGX25DF672C7N 33 × 33 mm, 1 mm pitch Pin Configuration Guide
Complete pinout information for EP1SGX25DF672C7N (33 × 33 mm, 1 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX25DF672C7N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25DF672C7N is suitable for 7 applications: High-Speed Serial Backplane Interface, Telecom Line Card Protocol Processing, Wireless Baseband Signal Processing, High-Throughput Data Acquisition System, Video Broadcast Equipment, PCIe Endpoint / Root Complex Design, Industrial Control & Test Equipment.
High-Speed Serial Backplane Interface
The EP1SGX25DF672C7N is purpose-built for serial backplane applications through its 4 multi-gigabit transceivers rated to 3.125 Gbps. These transceivers integrate 8B/10B encoding, word alignment, and clock-data recovery, eliminating the need for external PHY chips on the line card. Placed on switch fabric line cards, the FPGA aggregates multiple backplane lanes into parallel logic, with 25,660 logic elements providing ample headroom for protocol processing and packet buffering.
Recommended
Telecom Line Card Protocol Processing
The 25,660 logic elements and 1.944 Mbits of block RAM in the EP1SGX25DF672C7N make it ideal for telecom line cards that need to terminate serial protocols and process payloads in parallel. The FPGA typically handles framing, deframing, and cell/packet reassembly for protocols like Serial RapidIO or custom backplane fabrics. The 672-FBGA package supports up to 455 user I/O for connection to network processors and traffic managers.
Recommended
Wireless Baseband Signal Processing
In wireless base station designs, the EP1SGX25DF672C7N's combination of DSP blocks, block RAM, and multi-gigabit transceivers enables digital up/down conversion, channelization, and CPRI/OBSAI fronthaul interfacing. The transceiver data rate supports CPRI rates up to 3.072 Gbps (option 3), connecting the baseband FPGA to remote radio heads. The 25K logic elements accommodate multiple antenna paths in a single device.
Recommended
High-Throughput Data Acquisition System
The EP1SGX25DF672C7N serves as the processing heart of high-speed data acquisition systems, accepting data from multi-gigabit ADCs through its transceivers and performing real-time DSP, packetization, and storage interface logic. The 1.944 Mbits of embedded RAM provide buffering for high-bandwidth streaming data. The commercial 0–85 °C operating range suits laboratory and industrial instrumentation environments.
Recommended
Video Broadcast Equipment
Broadcast video routers and processing equipment leverage the EP1SGX25DF672C7N's transceivers for SDI (Serial Digital Interface) transport at 270 Mbps, 1.485 Gbps, and 2.97 Gbps standards (SD-SDI, HD-SDI, 3G-SDI). The 25K logic elements support real-time video processing functions such as up/down/cross-conversion, color space conversion, and overlay generation. Multiple transceivers allow multi-channel video aggregation in a single FPGA.
Recommended
PCIe Endpoint / Root Complex Design
The EP1SGX25DF672C7N supports PCI Express Gen 1 (2.5 Gbps) endpoint and root complex designs through its integrated transceivers, with Altera-provided PCIe IP cores in Quartus II. The 672-FBGA package supplies sufficient user I/O for system integration including memory controllers (DDR/DDR2) and local bus interfaces. Design teams can prototype PCIe Gen 1 systems before migrating to Cyclone V GT or Arria V GZ for production.
Recommended
Industrial Control & Test Equipment
In industrial test and measurement equipment, the EP1SGX25DF672C7N provides reconfigurable logic for custom instrument front-ends, signal generation, and protocol bridging. The combination of 25K logic elements, multi-gigabit transceivers, and 455 user I/O suits high-channel-count instruments such as protocol analyzers, ATE (Automatic Test Equipment) interface cards, and high-speed digitizers. The commercial temperature range fits factory floor and laboratory use cases.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25DF672C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25DF672C7ES | EP1SGX25DF672C7 | EP1SGX25DF672C6N | EP1SGX25CF672C7N | EP1SGX10DF672C7N |
|---|---|---|---|---|---|---|
| Package | 672-FBGA (33x33 mm) | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | [DATA_NEEDED] | 10,660 |
| Speed Grade | C7 | C7 ES | C7 | C6 (slower) | C7 | C7 |
| Transceivers | 4 × 3.125 Gbps | 4 × 3.125 Gbps | 4 × 3.125 Gbps | 4 × 3.125 Gbps | [DATA_NEEDED] | [DATA_NEEDED] |
| User I/O (Max) | 455 | 455 | 455 | 455 | [DATA_NEEDED] | [DATA_NEEDED] |
| Operating Temperature | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Key Differentiators
- Integrated multi-gigabit transceivers eliminate external PHY chips (vs EP1S25F672C7N (non-GX Stratix))
- Higher logic density than Stratix GX 10K variant (vs EP1SGX10DF672C7N)
- Same 672-FBGA footprint across the Stratix GX family (vs EP1SGX25DF1020C7N)
Design Notes
The EP1SGX25DF672C7N with active transceivers can dissipate 5-8 W under typical workloads, scaling up with transceiver utilization and logic toggle rates. The 672-FBGA package requires a multi-layer PCB thermal solution including thermal vias under the exposed die pad and adequate copper pour on inner/outer layers. Designers must consult Altera's PowerPlay early power estimation tools in Quartus II before PCB layout to size the thermal solution correctly.
The 672-FBGA package with 1.0 mm pitch demands HDI PCB stack-up with microvia-in-pad technology for breakout routing. Each BGA ball requires at least one ground via for signal return paths and power decoupling. Maintain 100 µF of bulk decoupling per power rail (VCCINT, VCCIO, VCCA, VCCP) with 0.1 µF and 1 nF high-frequency capacitors placed as close as possible to the package balls. Reference the Altera Stratix GX hardware reference design for stack-up recommendations.
Transceiver channels must be routed with controlled-impedance differential pairs (typically 100 Ω differential) with matched lengths within a lane (intra-pair skew < 1 ps) and inter-lane matching per protocol specification. Use loss-controlled PCB material such as Megtron 6 or Rogers RO4350B for channels exceeding 10 Gbps·inch. Transceiver reference clocks require dedicated low-jitter oscillators (typical 100 MHz, < 1 ps RMS jitter) routed with isolation from switching signals.
Common pitfalls include: (1) failing to use Altera's configuration device (EPC16 or EPCS) for fast parallel configuration, leading to slow serial boot times; (2) ignoring the JTAG chain topology and TDI/TDO pin assignment that creates configuration failures; (3) overlooking the special power-up sequencing requirements for VCCINT before VCCIO; (4) using non-IBIS-validated models for backplane channel simulation. Always validate the complete reference design flow with Quartus II before committing to layout.
Compliance Information
RoHS-compliant per Altera/Intel product page; lead-free BGA balls. AEC-Q100 not applicable for FPGAs. REACH status not explicitly confirmed in available data. Last Time Buy status as of 2026-09-07.
