EP20K100FC144-1X vs EP20K100EFC144-1 Comparison

Detailed side-by-side comparison of EP20K100FC144-1X by Intel and EP20K100EFC144-1 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP20K100FC144-1X EP20K100EFC144-1
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete NRND
Series APEX-20K —
Number of Logic Elements (LEs) 4,160 —
Logic Array Blocks (LABs) 416 —
Embedded RAM Bits 53,248 —
Number of User I/O 93 —
Number of Gates 100,000 (typical system gates) —
Package 144-pin TQFP (FC) —
Mounting Type Surface Mount Surface Mount
Speed Grade -1 (standard) —
Temperature Grade Commercial (0 °C to +85 °C) —
Process Technology 0.18 µm CMOS, SRAM-based configuration 0.15-µm all-layer copper
Core Voltage [DATA_NEEDED: VCCINT] —
I/O Voltage [DATA_NEEDED: VCCIO range] —
Configuration Mode Passive Serial / Passive Parallel / Boundary Scan —
RoHS Status Not RoHS compliant (legacy commercial TQFP) [DATA_NEEDED: RoHS compliance]
Lifecycle Obsolete — discontinued by Intel/Altera —
Device Family — APEX 20KE
Device Type — FPGA (Field Programmable Gate Array)
Typical Gates — 100,000
Maximum System Gates — 263,000
Logic Elements — 4,160
Embedded System Blocks (ESBs) — Yes (memory + dedicated logic)
User I/Os — 93
Propagation Delay — 1.6 ns
PLLs — 4
Package Type — 144-ball FBGA (13x13 mm, 1.0 mm pitch)
Core Voltage (VCCINT) — 1.71 V to 1.89 V
I/O Voltage Support — 1.8 V / 2.5 V / 3.3 V (multiVolt I/O)
Operating Temperature — 0 °C to 85 °C (commercial)
Configuration Method — SRAM (volatile) - external boot PROM required
Boundary-Scan Support — IEEE 1149.1 (JTAG)

Datasheets & Resources

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