EP20K400FI672-1XN vs EP20K400FI672-1X Comparison
Detailed side-by-side comparison of EP20K400FI672-1XN by Intel and EP20K400FI672-1X by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP20K400FI672-1XN | EP20K400FI672-1X |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | NRND | Obsolete |
| Family | APEX 20K | APEX 20K |
| Device | EP20K400 | — |
| Typical Gates | 400,000 | 400000 |
| Logic Elements | 16,640 | 16640 |
| Maximum User I/O Pins | 488 | — |
| Embedded System Memory | 212 Kbit | — |
| Number of PLLs | 4 | — |
| Core Supply Voltage | 2.5 V (2.375 V to 2.625 V) | — |
| I/O Supply Voltage | 2.5 V / 3.3 V | — |
| Process Technology | 0.18 micrometer CMOS | CMOS |
| Package | 672-ball FineLine BGA (FI672) | 672-BGA (FineLine BGA, 27 x 27 mm) |
| Package Size | 27 mm x 27 mm | — |
| Operating Temperature | -40 C to +85 C (industrial) | — |
| Configuration Method | SRAM, JTAG, EPC serial PROM | — |
| JTAG Support | IEEE 1149.1 boundary-scan compliant | — |
| Speed Grade | -1 | -1X |
| RoHS Status | [DATA_NEEDED: RoHS status] | — |
| MSL Level | 3 | 3 |
| Embedded Memory (bits) | — | 212992 |
| Maximum User I/O | — | 488 |
| Dedicated Inputs | — | 4 |
| Number of Terminals | — | 672 |
| Terminal Form | — | Ball |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Nominal Core Voltage (VCCINT) | — | 2.5 V |
| VCCINT Range | — | 2.375 V to 2.625 V |
| Mounting Type | — | Surface Mount |
| Peak Reflow Temperature | — | 220 C |