EP20K400FI672-1XN vs EP20K400FI672-1X Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP20K400FI672-1XN sa pamamagitan ng Intel at EP20K400FI672-1X sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP20K400FI672-1XN | EP20K400FI672-1X |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Obsolete |
| Family | APEX 20K | APEX 20K |
| Device | EP20K400 | — |
| Typical Gates | 400,000 | 400000 |
| Logic Elements | 16,640 | 16640 |
| Maximum User I/O Pins | 488 | — |
| Embedded System Memory | 212 Kbit | — |
| Number of PLLs | 4 | — |
| Core Supply Voltage | 2.5 V (2.375 V to 2.625 V) | — |
| I/O Supply Voltage | 2.5 V / 3.3 V | — |
| Process Technology | 0.18 micrometer CMOS | CMOS |
| Packhaging | 672-ball FineLine BGA (FI672) | 672-BGA (FineLine BGA, 27 x 27 mm) |
| Package Size | 27 mm x 27 mm | — |
| Temperature na Operasyon | -40 C to +85 C (industrial) | — |
| Configuration Method | SRAM, JTAG, EPC serial PROM | — |
| JTAG Support | IEEE 1149.1 boundary-scan compliant | — |
| Speed Grade | -1 | -1X |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | — |
| Level ng MSL | 3 | 3 |
| Embedded Memory (bits) | — | 212992 |
| Maximum User I/O | — | 488 |
| Dedicated Inputs | — | 4 |
| Number of Terminals | — | 672 |
| Terminal Form | — | Ball |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Nominal Core Voltage (VCCINT) | — | 2.5 V |
| VCCINT Range | — | 2.375 V to 2.625 V |
| Uri ng Pagpapasok | — | Surface Mount |
| Peak Reflow Temperature | — | 220 C |