EP20K600EFC672-2X vs EP20K600EFC672-1XN Comparison

Detailed side-by-side comparison of EP20K600EFC672-2X by Intel and EP20K600EFC672-1XN by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP20K600EFC672-2X EP20K600EFC672-1XN
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Family APEX 20KE APEX 20K (APEX-20KE)
Typical Gates 600,000 —
Logic Elements / Cells 24,320 —
Embedded Memory Bits 311,296 —
Maximum User I/O 508 —
Number of PLLs 4 —
Package Type 672-pin FineLine BGA (FC-FBGA) —
Package Size 45 x 45 mm, 1.27 mm pitch —
Core Voltage 1.8 V —
Process Technology 0.15 µm all-layer copper CMOS 0.18 micron CMOS
Propagation Delay (typical) 1.48 ns —
Maximum Internal Frequency 200 MHz —
Operating Temperature 0 °C to +85 °C (commercial) 0C to 85C (commercial)
Lead-Free Variant EP20K600EFC672-2N —
RoHS Status Not RoHS compliant (X suffix is SnPb); use -2N suffix for lead-free [DATA_NEEDED: RoHS status]
Configuration Method Serial / Parallel (Quartus-supported) Serial or parallel, JTAG
System Gates — 1,560,000 (typical 600K)
Logic Elements — 24,320
Typical Logic Elements — 311,296
Macros (Logic Array Blocks) — 2,432
User I/O Pins — 508
Total RAM Bits — [DATA_NEEDED: total RAM bits]
Package — 672-ball FineLine BGA (FBGA)
Ball Pitch — 1.0 mm
Supply Voltage (Core) — 1.8 V typical
Speed Grade — -1 (fastest)
Mounting Type — Surface Mount (BGA)
MSL Level — [DATA_NEEDED: MSL level]

Datasheets & Resources

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