EP2A25F1020C8ES vs EP2A25B652C7 Comparison
Detailed side-by-side comparison of EP2A25F1020C8ES by Intel and EP2A25B652C7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2A25F1020C8ES | EP2A25B652C7 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last_time_buy | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $165.00 | $285.00 |
| Family | APEX II | APEX II |
| Logic Elements | 24,320 | Approximately 25,000 LE |
| System Gates | 2,750,000 | β |
| Embedded Memory (bits) | 622,592 | β |
| Maximum User I/O | 735 | β |
| Package | 1020-ball FineLine BGA | 652-ball FineLine BGA |
| Package Code Suffix | F1020 | β |
| Speed Grade | 8 | -7 |
| Temperature Grade | Commercial (0 C to +85 C) | β |
| Suffix Code | ES (Engineering Sample) | β |
| Core Voltage (VCCINT) | [DATA_NEEDED: VCCINT nominal] | β |
| Process Technology | [DATA_NEEDED: process node] | β |
| Mounting Type | Surface Mount (BGA) | β |
| MSL Level | 3 (168 Hours) | β |
| Packaging | Tray | β |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Embedded System Blocks (ESBs) | β | [DATA_NEEDED: ESB count] |
| Maximum User I/O Pins | β | 488 |
| Core Voltage | β | 1.5 V |
| I/O Bank Voltage | β | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| RAM Bits (approx.) | β | 40,960 |
| PLLs | β | 4 |
| Supported I/O Standards | β | LVTTL, LVCMOS, SSTL, LVDS |
| Configuration Method | β | JTAG / Passive Serial / Active Serial |
| Boundary Scan | β | IEEE 1149.1 compliant |
| Design Software | β | Quartus II |
| Operating Temperature | β | Commercial 0C to +85C |