EP2A25F1020C8ES vs EP2A25B652C7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2A25F1020C8ES sa pamamagitan ng Intel at EP2A25B652C7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2A25F1020C8ES | EP2A25B652C7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Obsolete |
| Family | APEX II | APEX II |
| Logic Elements | 24,320 | Approximately 25,000 LE |
| System Gates | 2,750,000 | — |
| Embedded Memory (bits) | 622,592 | — |
| Maximum User I/O | 735 | — |
| Packhaging | 1020-ball FineLine BGA | 652-ball FineLine BGA |
| Package Code Suffix | F1020 | — |
| Speed Grade | 8 | -7 |
| Temperature Grade | Commercial (0 C to +85 C) | — |
| Suffix Code | ES (Engineering Sample) | — |
| Core Voltage (VCCINT) | [DATA_NEEDED: VCCINT nominal] | — |
| Process Technology | [DATA_NEEDED: process node] | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Level ng MSL | 3 (168 Hours) | — |
| Packaging | Tray | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Embedded System Blocks (ESBs) | — | [DATA_NEEDED: ESB count] |
| Maximum User I/O Pins | — | 488 |
| Core Voltage | — | 1.5 V |
| I/O Bank Voltage | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| RAM Bits (approx.) | — | 40,960 |
| PLLs | — | 4 |
| Supported I/O Standards | — | LVTTL, LVCMOS, SSTL, LVDS |
| Configuration Method | — | JTAG / Passive Serial / Active Serial |
| Boundary Scan | — | IEEE 1149.1 compliant |
| Design Software | — | Quartus II |
| Temperature na Operasyon | — | Commercial 0C to +85C |