EP2A25F672C8N vs EP2A25F672C9ES Comparison
Detailed side-by-side comparison of EP2A25F672C8N by Intel and EP2A25F672C9ES by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2A25F672C8N | EP2A25F672C9ES |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Last_time_buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $205.00 | $122.00 |
| Family | APEX II | APEX II |
| Technology Node | 0.15 um all-layer copper process | β |
| System Gates | 900,000 | 900,000 |
| Logic Elements / Cells | 24,320 | β |
| Maximum Internal Frequency | 333 MHz | β |
| Propagation Delay | 1.69 ns | 1.69 ns |
| User I/Os | 492 | 492 |
| Package | 672-ball FC-FBGA (FineLine BGA) | 672-pin FC-FBGA (FineLine BGA), 27 x 27 mm, 1.0 mm pitch |
| Package Body Size | 27 x 27 mm | β |
| Ball Pitch | 1.0 mm | β |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Speed Grade | C8 | -9 |
| Operating Temperature | 0 C to 85 C (commercial) | 0 Β°C to 85 Β°C (Commercial) |
| Multi-Gigabit Transceiver Rate | Up to 1 Gbps per channel | β |
| Mounting Type | Surface Mount | Surface Mount |
| RoHS Status | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Lead-Free Suffix | N (lead-free, Pb-free finish) | β |
| Logic Elements | β | 24,320 |
| Maximum Operating Frequency | β | 236 MHz |
| Process Technology | β | 0.15 Β΅m CMOS (up to 8 metal layers, all-layer copper) |
| Configuration Class | β | ES (Enhanced) |
| MSL Level | β | [DATA_NEEDED: MSL moisture sensitivity level] |
| Logic Family | β | CMOS |