EP2A25F672C8N vs EP2A25F672C9ES Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2A25F672C8N sa pamamagitan ng Intel at EP2A25F672C9ES sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2A25F672C8N | EP2A25F672C9ES |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Huling Pagbili |
| Family | APEX II | APEX II |
| Technology Node | 0.15 um all-layer copper process | — |
| System Gates | 900,000 | 900,000 |
| Logic Elements / Cells | 24,320 | — |
| Maximum Internal Frequency | 333 MHz | — |
| Propagation Delay | 1.69 ns | 1.69 ns |
| User I/Os | 492 | 492 |
| Packhaging | 672-ball FC-FBGA (FineLine BGA) | 672-pin FC-FBGA (FineLine BGA), 27 x 27 mm, 1.0 mm pitch |
| Package Body Size | 27 x 27 mm | — |
| Ball Pitch | 1.0 mm | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Speed Grade | C8 | -9 |
| Temperature na Operasyon | 0 C to 85 C (commercial) | 0 °C to 85 °C (Commercial) |
| Multi-Gigabit Transceiver Rate | Up to 1 Gbps per channel | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Lead-Free Suffix | N (lead-free, Pb-free finish) | — |
| Logic Elements | — | 24,320 |
| Maximum Operating Frequency | — | 236 MHz |
| Process Technology | — | 0.15 µm CMOS (up to 8 metal layers, all-layer copper) |
| Configuration Class | — | ES (Enhanced) |
| Level ng MSL | — | [DATA_NEEDED: MSL moisture sensitivity level] |
| Logic Family | — | CMOS |