EP2A25F672I8 vs EP2A40F33I-8 Comparison

Detailed side-by-side comparison of EP2A25F672I8 by Altera and EP2A40F33I-8 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2A25F672I8 EP2A40F33I-8
Brand Altera Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Family APEX II APEX II
Logic Elements / Cells 24,320 —
Equivalent Gates 900,000 —
Embedded Memory (RAM bits) 622,592 —
User I/Os 492 —
Number of PLLs 4 —
Process Technology 0.15 µm CMOS, up to 8 metal layers —
Core Supply Voltage 1.5 V —
Propagation Delay 1.69 ns (typical) —
Internal Performance 333 MHz (per legacy datasheet) —
LVDS / High-Speed I/O Yes, up to 1 Gbps —
Package 672-ball FC-FBGA (FineLine BGA), 27 × 27 mm, 1 mm pitch 672-ball FineLine BGA (F33)
Mounting Type Surface Mount (BGA) —
Operating Temperature –40 °C to +85 °C (industrial, 'I' grade) —
Speed Grade I8 (industrial, 8-speed-grade per APEX II ordering scheme) -8
JTAG / Boundary Scan IEEE 1149.1 compliant —
I/O Standards Supported LVTTL, LVCMOS, SSTL, HSTL, LVDS, LVPECL, GTL+, PCI —
RoHS Status unknown [DATA_NEEDED: RoHS status]
Lead-Free Status unknown —
Manufacturer — Intel (formerly Altera)
Device Type — FPGA (Field-Programmable Gate Array)
Typical Gates — 1,500,000
Logic Elements (LEs) — 40,960
Embedded System Memory — 425,984 bits
Maximum User I/O — 672
Temperature Grade — Industrial (-40 °C to +85 °C)
PLLs — 4
High-Speed Clock Pins — 16
Configuration Method — SRAM (volatile) - external PROM required
Moisture Sensitivity Level — MSL 3
Peak Reflow Temperature — 220 °C

Datasheets & Resources

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