EP2A40B652C7 vs EP2A40F780 Comparison
Detailed side-by-side comparison of EP2A40B652C7 by Intel and EP2A40F780 by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2A40B652C7 | EP2A40F780 |
|---|---|---|
| Brand | Intel | Altera |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last Time Buy | Last Time Buy |
| Device Family | APEX II | — |
| Logic Elements | 40,000 LEs | 30,000 |
| Maximum User I/O Pins | 538 (per package, [DATA_NEEDED: exact count for BGA-652]) | [DATA_NEEDED: maximum user I/O count] |
| Package | 652-ball FineLine BGA | 780-ball FineLine BGA (FBGA) |
| Embedded Memory | [DATA_NEEDED: ESB RAM bits for EP2A40] | — |
| Number of PLLs | [DATA_NEEDED: PLL count for EP2A40] | — |
| Operating Temperature Grade | Commercial (C suffix) | — |
| Speed Grade | 7 | — |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, GTL+, SSTL, LVDS, LVPECL | — |
| Supply Voltage (Core) | 1.8 V nominal [DATA_NEEDED: exact tolerance] | — |
| Supply Voltage (I/O) | Multi-voltage I/O [DATA_NEEDED: VCCIO range] | — |
| Process Technology | [DATA_NEEDED: process node] | [DATA_NEEDED: process node] |
| Configuration Method | SRAM-based, supported via EPC configuration devices | — |
| RoHS Status | Unknown | [DATA_NEEDED: RoHS status] |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| MSL Level | [DATA_NEEDED: MSL rating] | — |
| Family | — | APEX II |
| Device | — | EP2A40 |
| Typical Gates | — | 1,500,000 |
| Operating Temperature | — | [DATA_NEEDED: temperature grade] |
| Configuration Memory | — | SRAM-based |
| Embedded System Blocks (ESBs) | — | [DATA_NEEDED: ESB count] |
| JTAG Support | — | IEEE 1149.1 boundary-scan |
| Programming File Format | — | .sof/.pof via Quartus II |
| Core Voltage | — | [DATA_NEEDED: VCCINT] |
| I/O Voltage | — | [DATA_NEEDED: VCCIO range] |