EP2A70B724I-9 vs EP2A70B724I9 Comparison

Detailed side-by-side comparison of EP2A70B724I-9 by Altera and EP2A70B724I9 by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2A70B724I-9 EP2A70B724I9
Brand Altera Altera
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Family APEX II APEX II
Logic Elements (typical) 70,000 —
Embedded RAM (ESB bits) 4,290 Kbit —
Maximum User I/O [DATA_NEEDED: max user I/O count] —
Package BGA-724 724-pin FCBGA (Flip-Chip BGA)
Speed Grade -9 —
Operating Temperature -40C to +100C (industrial, 'I' suffix) —
Process Node [DATA_NEEDED: process node] —
Supply Voltage Core 1.5 V (typical) —
Supply Voltage I/O 3.3 V (typical, multi-voltage I/O banks supported) —
Configuration Method Passive Serial, Passive Parallel, EPC4/EPC8/EPC16 enhanced configuration devices —
Peak Reflow Temperature 220 C —
Mounting Type Surface Mount (BGA) Surface Mount
MSL Level [DATA_NEEDED: MSL rating] —
RoHS Status unknown [DATA_NEEDED: RoHS compliance status]
Logic Elements — 67,200
System Gates — Approximately 3,000,000
Embedded Memory — 540 Kbits (1,146,880 bits total ESB memory per Jotrin listing)
Process Technology — 0.15 µm CMOS
Core Voltage — 1.5 V
Maximum Operating Frequency — 198 MHz
Number of PLLs — 4
Embedded System Blocks (ESBs) — 4
Operating Temperature Grade — Industrial (-40C to +100C)
I/O Standards Supported — LVTTL, LVCMOS, SSTL, HSTL, LVDS
Configuration Mode — SRAM-based, configurable via JTAG or EPC enhanced configuration devices

Datasheets & Resources

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