EP2A70F1736C9 vs EP2A70F1736C8 Comparison

Detailed side-by-side comparison of EP2A70F1736C9 by Intel and EP2A70F1736C8 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2A70F1736C9 EP2A70F1736C8
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $175.00 $105.00
Family APEX II —
Typical Gates 70,000 —
Logic Elements 53,376 (approx) —
Package 1736-ball FineLine BGA —
Operating Temperature 0C to +85C (Commercial) 0°C to 85°C (TJ, commercial)
Process Technology 0.18 um CMOS 0.18 µm CMOS
Core Voltage 1.5 V —
I/O Voltage Support 1.8 V / 2.5 V / 3.3 V / 5 V (MultiVolt) —
Embedded System Blocks (ESBs) Yes (dual-port RAM/FIFO/CAM capable) [DATA_NEEDED: ESB count]
PLL Count 4 [DATA_NEEDED: PLL count]
Maximum User I/O Pins 1072 —
Programming Interface JTAG (IEEE 1149.1) + in-system —
Mounting Type Surface Mount (BGA) Surface Mount
RoHS Status [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS compliance]
Lead-Free [DATA_NEEDED: lead-free status] —
Series — APEX II
Manufacturer — Intel (formerly Altera)
Logic Elements (LEs) — 67,200
Total RAM Bits — 1,146,880
Core Supply Voltage — 1.425 V to 1.575 V (1.5 V nominal)
Package / Case — 1736-ball FC-BGA
Supplier Device Package — 1736-pin FC-BGA
Logic Array Blocks (LABs) — [DATA_NEEDED: LAB count]
User I/O Banks — [DATA_NEEDED: I/O bank count]
Maximum User I/O — [DATA_NEEDED: maximum user I/O count]
MultiCore Interconnect — Yes (per APEX II family datasheet)
Configuration Scheme — PS / JTAG / PPA
Lead Free — Per manufacturer datasheet
Moisture Sensitivity Level (MSL) — Per JEDEC J-STD-020 (package-dependent)

Datasheets & Resources

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